EP3SE260H780C3N

The EP3SE260H780C3N is a Stratix® III field-programmable gate array (FPGA) in a 780-BBGA (FCBGA) package, offered as a commercial‑grade, surface‑mount device. It integrates a high density of programmable logic, embedded memory, DSP resources and advanced I/O architecture from the Stratix III device family to address demanding system and board-level functions.

Designed for applications requiring substantial on‑chip logic and memory resources, this device delivers a combination of programmable logic capacity, approximately 16.67 Mbits of embedded memory, and 488 general I/O pins while operating across a VCC range of 860 mV to 1.15 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• High Logic Capacity — 255,000 logic elements (cells) provides extensive programmable fabric for complex logic, control and data‑path implementations.
• Embedded Memory — Approximately 16.67 Mbits of on‑chip RAM (TriMatrix embedded memory blocks referenced in the Stratix III documentation) to support buffering, FIFOs and on‑chip data storage.
• DSP and Arithmetic Resources — Stratix III family DSP blocks and arithmetic resources (documented in the device handbook) for high‑throughput signal processing and computational tasks.
• Rich I/O — 488 I/O pins and documented high‑speed differential I/O interfaces with DPA support for demanding serial and parallel connectivity.
• Clocking and PLLs — Integrated clock networks and PLL resources (described in the Stratix III handbook) for flexible clock management and domain crossing.
• Configuration and Test — Standard configuration and IEEE 1149.1 (JTAG) boundary‑scan testing support as described in the device documentation for system bring‑up and board test.
• Design Security and Reliability — Device handbook references design security features and SEU mitigation options to support protected and resilient designs.
• Package & Mounting — 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33). Surface mount mounting type simplifies board assembly for compact, high‑density designs.
• Power and Temperature — Core voltage range specified at 860 mV to 1.15 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• High‑Speed Interfaces — Implement protocol bridging and interface logic that leverage the device's high I/O count and documented high‑speed differential I/O capabilities.
• Signal Processing & DSP — Use the Stratix III DSP resources and large logic capacity for real‑time filtering, modulation/demodulation, and other compute‑intensive algorithms.
• Memory Controller & Buffering — On‑chip memory (approximately 16.67 Mbits) and abundant logic support custom external memory interfaces and on‑chip buffering.
• System Integration & Prototyping — High logic density and flexible clocking make the device suitable for integrating multiple functions and validating complex system architectures.

Unique Advantages

• High density programmable fabric: 255,000 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board complexity and part count.
• Substantial embedded memory: Approximately 16.67 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and packet‑storage tasks.
• Extensive I/O capability: 488 I/O pins and documented high‑speed I/O architectures support broad connectivity requirements without additional I/O expanders.
• Family‑level feature set: Stratix III architecture elements such as DSP blocks, PLLs, and advanced interconnects provide proven building blocks for performance‑oriented designs.
• Commercial availability and RoHS compliance: Commercial grade rating and RoHS compliance support mainstream product development and regulatory needs.
• Surface‑mount 780‑BBGA package: Compact FCBGA implementation aids in space‑constrained board layouts while providing thermal and electrical packaging suitable for high‑density designs.

Why Choose EP3SE260H780C3N?

The EP3SE260H780C3N delivers a high‑density Stratix III FPGA option for designs that require substantial logic resources, significant embedded memory, and broad I/O capability in a commercial‑grade, surface‑mount 780‑BBGA package. Its combination of programmable logic, DSP resources and documented family features such as TriMatrix memory, clock networks and high‑speed I/O make it well suited for systems that integrate complex signal processing, interface logic and memory controller functions.

Choose this device for projects that demand scalability within the Stratix III family, a sizable on‑chip resource set, and documented configuration, test and reliability features to support robust product development and deployment.

If you would like pricing, availability, or a formal quote for EP3SE260H780C3N, please submit a request for a quote or pricing inquiry and our team will respond with the next steps.