EP3SE50F484C3N

The EP3SE50F484C3N is a Stratix® III field programmable gate array (FPGA) IC from Intel (Altera) designed for commercial-grade embedded and system applications. This device delivers a high logic element count, substantial on-chip memory, and a broad I/O complement in a compact 484-FBGA (23×23) surface-mount package.

Built for designs that require programmable logic density, embedded memory and flexible I/O, the part supports integration of compute, memory interface and I/O functions within a single FPGA fabric while operating from a core supply range of 860 mV to 1.15 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 47,500 logic elements for implementing complex combinational and sequential logic and system-level functions.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, packet storage, and local data structures without external memory in many use cases.
• I/O Density  296 general-purpose I/O pins to support multi-channel interfaces, parallel buses, and mixed-signal front-end connectivity.
• Package & Mounting  484-FBGA (23×23) FCBGA package in a surface-mount form factor for space-efficient PCB layouts and high-pin-count system designs.
• Power and Thermal  Core voltage support from 860 mV to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C allow integration into a wide range of board-level power and thermal envelopes.
• Series Architecture  Stratix III family features (documented in the device handbook) such as TriMatrix embedded memory blocks, DSP blocks, clock networks and PLLs, high-speed differential I/O interfaces, configuration tools and JTAG boundary-scan support.
• Compliance  RoHS-compliant component suitable for commercial production environments.

Typical Applications

• High-density logic integration  Use as a system logic hub where tens of thousands of logic elements and on-chip RAM consolidate multiple functions into a single FPGA.
• Embedded memory buffering  On-chip RAM capacity supports buffering and packet staging for data-path tasks and temporary storage without immediate reliance on external memory.
• Multi-interface systems  Large I/O count enables support for parallel buses, I/O expansion, and mixed-protocol front-ends in communication and instrumentation equipment.

Unique Advantages

• High logic density: The device’s ~47,500 logic elements enable complex logic consolidation, reducing the need for multiple discrete components.
• Substantial embedded memory: Approximately 5.76 Mbits of on-chip RAM lowers external memory requirements and simplifies board-level design.
• Generous I/O resources: 296 I/O pins give flexibility for multi-channel connectivity and peripheral interfacing on a single package.
• Compact, high-pin-count package: 484-FBGA (23×23) surface-mount packaging balances high connectivity with a small PCB footprint.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet industry-standard commercial system requirements.
• RoHS compliant: Meets lead-free and material compliance requirements for modern electronics manufacturing.

Why Choose EP3SE50F484C3N?

The EP3SE50F484C3N combines a high logic element count, substantial embedded memory and a large I/O complement in a compact 484-FBGA package, delivering a balanced platform for commercial embedded and system designs that require programmable logic density and on-chip resources. Its Stratix III family architecture provides the foundational features engineers expect for memory interfacing, DSP and clocking support while fitting within standard board-level power and thermal constraints.

This device is well suited to developers and system integrators who need to consolidate multiple functions into a single FPGA, reduce BOM complexity, and leverage documented Stratix III architecture capabilities in commercial-temperature applications.

Request a quote or submit an inquiry to obtain pricing and availability for the EP3SE50F484C3N and to discuss how it fits your next design.