EP3SE50F484C4LG

The EP3SE50F484C4LG is a Stratix® III E field-programmable gate array supplied in a 484-ball BGA (FCBGA) package. It delivers a balance of dense logic, substantial on-chip memory and I/O capability for data-centric and DSP-focused designs.

Designed for commercial applications, this device pairs approximately 5.76 Mbits of embedded memory with 47,500 logic elements and 296 user I/O pins, providing a compact, high-integration option where programmable logic, memory bandwidth and interface density are required.

Key Features

• Logic Capacity — 47,500 logic elements to implement combinational and sequential logic for complex FPGA designs.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for buffering, FIFOs and state storage.
• I/O — 296 user I/O pins in a modular I/O bank architecture for flexible interfacing to external devices and memories.
• Package & Mounting — 484-BBGA (supplier package: 484-FBGA, 23×23); surface-mount mounting for standard PCB assembly.
• Core Voltage Range — Selectable core supply from 0.86 V to 1.15 V to support power/performance trade-offs.
• Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for a wide range of non-industrial applications.
• Power & Efficiency (Family Feature) — Stratix III family Programmable Power Technology and selectable core voltage enable tailoring power consumption to active circuitry.
• DSP and Memory Architecture (Family Feature) — Family-level support for high-speed DSP blocks and multiple RAM block sizes to implement multipliers, MAC functions and FIFO buffers.
• Reliability & Security (Family Feature) — Family-level options include configuration memory CRC, ECC for TriMatrix memory blocks, and support for 256-bit AES encryption keys.

Typical Applications

• Data Processing & Acceleration — Implements custom data-paths and DSP algorithms using the device’s logic elements and embedded memory for buffering and pipeline stages.
• Memory Interface Controllers — Suitable for designs requiring on-chip memory and flexible I/O to bridge or manage external memory subsystems.
• Communications & Protocol Bridging — Use the programmable I/O and modular bank architecture to implement protocol translators, custom packet-processing or interface logic.

Unique Advantages

• High Integration in a Compact Package: 47,500 logic elements and approximately 5.76 Mbits of embedded memory in a 484-BBGA footprint reduce board-level component count and simplify system design.
• Flexible Power/Performance Trade-offs: Core voltage selectable between 0.86 V and 1.15 V permits tuning for performance or reduced power consumption.
• Ample I/O Density: 296 user I/O pins in modular banks enable diverse external interfaces without additional bridge devices.
• Commercial Temperature Support: Rated for 0 °C to 85 °C to match standard commercial product requirements and environments.
• Family-Level DSP and Reliability Features: Leverages Stratix III family capabilities such as dedicated DSP blocks, ECC for memory integrity and optional AES configuration security.

Why Choose EP3SE50F484C4LG?

The EP3SE50F484C4LG positions itself as a scalable, memory-rich Stratix® III E FPGA for designs that need substantial on-chip RAM, a high logic count and flexible I/O in a single surface-mount package. It is well suited for engineering teams developing data-centric processing, custom interfaces or DSP-accelerated subsystems where programmable integration and configurable power/performance are required.

Choosing this device provides a clear upgrade path within the Stratix III family, with family-level features for clocking, DSP and configuration reliability that support long-term design scalability and maintainability.

Request a quote or submit an inquiry to receive pricing and availability information for EP3SE50F484C4LG and to discuss how it fits your next design.