EP3SE50F484C4LN

The EP3SE50F484C4LN is a Stratix® III E Field Programmable Gate Array (FPGA) in a 484-ball FCBGA package. It provides a high-density programmable logic resource combined with embedded memory and a substantial I/O count for complex digital designs.

Key device parameters include approximately 5.76 Mbits of on-chip RAM, 47,500 logic elements, 296 I/O pins, a supply voltage range of 860 mV to 1.15 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is offered in a surface-mount 484-FBGA (23×23) package and is RoHS compliant.

Key Features

• Logic Resources  47,500 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Capacity  296 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power  Core supply range from 860 mV to 1.15 V to match system power rails and design constraints.
• Package & Mounting  484-ball FCBGA (484-BBGA) surface-mount package, supplier package specified as 484-FBGA (23×23) for compact board-level integration.
• Temperature Grade  Commercial temperature rating: 0 °C to 85 °C, for general-purpose electronic applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Complex digital processing  Use the device’s 47,500 logic elements and embedded RAM to implement multi-function processing blocks and custom datapaths.
• I/O-intensive interface bridging  296 I/O pins enable protocol translation, parallel/serial interfacing, and multi-channel signal routing.
• On-chip buffering and storage  Approximately 5.76 Mbits of RAM supports packet buffering, FIFOs, and temporary data storage within the FPGA fabric.

Unique Advantages

• High logic capacity: 47,500 logic elements allow implementation of large-scale digital designs without immediate need for external logic.
• Significant embedded memory: Approximately 5.76 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state storage needs.
• Extensive I/O count: 296 I/O pins provide flexibility for complex interfacing and parallel connectivity.
• Compact FCBGA packaging: 484-FBGA (23×23) enables dense board layouts while maintaining surface-mount assembly compatibility.
• Commercial-grade operation: Rated for 0 °C to 85 °C to meet typical commercial system environment requirements.
• RoHS compliant: Conforms to lead-free manufacturing and environmental requirements.

Why Choose EP3SE50F484C4LN?

The EP3SE50F484C4LN positions itself as a high-density, commercial-grade Stratix® III E FPGA that balances large programmable logic capacity, embedded memory, and a high I/O count in a compact 484-FBGA package. Its voltage and temperature ratings make it suitable for conventional electronic systems requiring substantial on-chip resources.

This device is well suited for design teams seeking a single-chip programmable solution that consolidates logic, memory, and I/O capabilities to reduce component count and simplify board-level integration, while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SE50F484C4LN.