EP3SE50F484C4G
| Part Description |
Stratix® III E Field Programmable Gate Array (FPGA) IC 296 5760000 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,803 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5760000 |
Overview of EP3SE50F484C4G – Stratix® III E FPGA, 47,500 logic elements (484‑BBGA, FCBGA)
The EP3SE50F484C4G is a Stratix® III E family Field Programmable Gate Array (FPGA) offered in a 484‑ball BGA (FCBGA) package. It provides a memory‑ and multiplier‑rich architecture suited for data‑centric designs, digital signal processing, and embedded logic implementations.
Designed for performance and power flexibility, the device supports selectable core voltages and programmable power management features to balance throughput and power consumption for system‑level efficiency.
Key Features
- Logic Capacity 47,500 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 5.76 Mbits of on‑chip RAM to support FIFOs, buffers, and local data storage.
- I/O and Packaging 296 user I/O pins in a 484‑BBGA (FCBGA) package; supplier package listed as 484‑FBGA (23×23). Surface‑mount mounting type.
- Core Voltage Range & Power Core supply range from 860 mV to 1.15 V and Programmable Power Technology for dynamic power/performance tradeoffs.
- DSP & Multiplier Support Family features include high‑speed DSP blocks and dedicated multipliers to accelerate multiply‑accumulate and filter functions.
- Clocking and PLLs Family‑level support includes multiple global and regional clocks and programmable PLLs for flexible clock synthesis and management.
- Security & Reliability Family features include optional configuration encryption and built‑in error detection/correction mechanisms to protect configuration and memory.
- Operating Range & Grade Commercial grade operation with an operating temperature range of 0°C to 85°C.
- Compliance RoHS compliant.
Typical Applications
- Digital Signal Processing (DSP) Use the device’s dedicated multiplier and DSP resources to accelerate FIR filters, FFTs, and other real‑time signal processing algorithms.
- High‑Performance Networking Memory‑rich architecture and extensive I/O support system interfaces and buffering for packet processing and line‑rate communications functions.
- Memory Interface Controllers On‑chip RAM and modular I/O banks support implementation of custom memory controllers and buffering for external DRAM interfaces.
- Embedded Logic and Custom Acceleration Implement custom compute accelerators, protocol offloads, and control logic where a balance of logic capacity and embedded memory is required.
Unique Advantages
- Memory‑Rich Architecture: Approximately 5.76 Mbits of embedded memory reduces external memory dependence and simplifies system BOM.
- Balanced Logic and DSP Resources: 47,500 logic elements combined with DSP blocks enable mixed control and signal processing workloads on a single device.
- Flexible Power Management: Selectable core voltage and programmable power features allow designers to tune performance versus power consumption.
- Robust I/O and Packaging: 296 I/O in a 484‑BBGA FCBGA package enables dense board integration and multiple interface options.
- Security and Reliability Features: Family‑level support for configuration encryption and error detection/correction enhances design protection and availability.
- Commercial Temperature Rating: Rated for 0°C to 85°C, suitable for a wide range of commercial and enterprise applications.
Why Choose EP3SE50F484C4G?
The EP3SE50F484C4G is positioned for designs that require substantial embedded memory and DSP capability alongside a moderate logic fabric. Its combination of 47,500 logic elements, approximately 5.76 Mbits of on‑chip RAM, and extensive I/O in a compact FCBGA package makes it well suited for data‑centric, signal processing, and embedded acceleration tasks where power flexibility and integration matter.
For engineering teams building commercial products that need scalable FPGA resources with configurable power and security features, this Stratix® III E device delivers a practical balance of capacity, reliability, and system‑level flexibility backed by documented family capabilities.
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