EP3SE50F484C4L

The EP3SE50F484C4L is a Stratix® III E Field Programmable Gate Array from Intel, delivered in a 484-ball FCBGA surface-mount package. It provides a substantial logic and I/O resource set for custom digital designs.

This device offers 47,500 logic elements, approximately 5.76 Mbits of embedded memory, and 296 I/Os. Key electrical and environmental parameters include a core voltage range of 0.860 V to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  47,500 logic elements and 1,900 logic blocks provide the programmable fabric for implementing complex digital functions.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic.
• I/O Resources  296 programmable I/O pins to interface with external peripherals, sensors, and other system components.
• Supply Voltage  Core voltage range from 0.860 V to 1.15 V to match system power requirements.
• Package & Mounting  484-ball BGA (FCBGA) package, supplier device package 484-FBGA (23×23), optimized for surface-mount assembly.
• Operating Grade  Commercial temperature grade with specified operation from 0 °C to 85 °C.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Custom digital logic  Implement user-defined processing and control functions using the device’s 47,500 logic elements and embedded memory.
• Prototyping and system integration  Use the FPGA’s abundant I/O (296 pins) and on-chip RAM to validate and integrate digital subsystems before ASIC commitment.
• High-density board designs  The 484-ball FCBGA package and surface-mount mounting support compact, high-density PCB layouts.

Unique Advantages

• High programmable logic count: 47,500 logic elements enable implementation of substantial custom logic without external ASICs.
• Significant embedded memory: Approximately 5.76 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state needs.
• Extensive I/O capability: 296 I/Os simplify interfacing to multiple peripherals and parallel buses.
• Compact BGA packaging: The 484-ball FCBGA (23×23) package allows high routing density and is compatible with surface-mount assembly processes.
• Commercial temperature range: Rated for 0 °C to 85 °C operation to match standard commercial deployments.
• Manufacturer-backed quality: Supplied by Intel as part of the Stratix® III E family, carrying expected manufacturing and quality traceability.

Why Choose EP3SE50F484C4L?

The EP3SE50F484C4L positions itself as a high-capacity Stratix® III E FPGA option for designs that require substantial programmable logic, embedded memory, and I/O resources in a compact surface-mount BGA footprint. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of standard electronic products and development platforms.

Engineers and procurement teams looking for a vendor-supported FPGA with 47,500 logic elements, roughly 5.76 Mbits of on-chip RAM, and 296 I/Os will find this device aligns to applications needing dense logic integration and flexible I/O in a 484-ball FCBGA package.

Request a quote or contact our sales team to obtain pricing, lead time, and availability for the EP3SE50F484C4L.