EP3SE50F484C4

The EP3SE50F484C4 is an Intel Stratix® III E field programmable gate array delivered in a 484-ball BGA (FCBGA) package. It provides approximately 47,500 logic elements, roughly 5.76 Mbits of embedded memory, and 296 user I/Os, making it suitable for commercial-grade designs that require substantial on-chip logic density and I/O capacity.

This device operates from a core supply range of 860 mV to 1.15 V, is specified for surface-mount PCB assembly, and is rated for commercial-temperature applications (0 °C to 85 °C). The package and density characteristics enable compact, board-level integration where configurable logic and embedded memory are required.

Key Features

• Core Logic  Provides approximately 47,500 logic elements for implementing complex, custom digital logic functions and glue-logic within a single device.
• Embedded Memory  Includes approximately 5.76 Mbits of on-chip RAM to support buffering, state storage, and data processing without external memory in many use cases.
• I/O Capacity  Offers 296 user I/Os to support dense board-level connectivity and multiple parallel interfaces.
• Power  Core supply operating range of 860 mV to 1.15 V to match system power-rail requirements for Stratix III E-class devices.
• Package and Mounting  Delivered in a 484-ball FCBGA (484-BBGA) package (supplier package noted as 484-FBGA, 23×23), optimized for surface-mount assembly and high-density boards.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C, suitable for commercial applications.
• Standards Compliance  RoHS compliant to align with environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Integration into commercial embedded platforms that require configurable logic density and on-chip memory while operating in standard commercial temperature ranges.
• High-density Board Designs  Use where a compact FCBGA package with high logic and I/O counts reduces board-level component count and supports dense routing.
• Custom Interface and Control  Implement custom interface logic and parallel I/O handling using the device’s substantial I/O resource and embedded RAM.

Unique Advantages

• High Logic Density: Approximately 47,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
• Significant On-Chip Memory: Roughly 5.76 Mbits of embedded RAM supports buffering and local data processing without immediate dependence on external memory.
• Ample I/O Resources: 296 user I/Os accommodate multiple interfaces and parallel signaling requirements directly on-chip.
• Compact FCBGA Packaging: The 484-ball FCBGA package (23×23 supplier footprint) provides a compact form factor for space-constrained board designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose EP3SE50F484C4?

The EP3SE50F484C4 combines a high logic element count, substantial on-chip RAM, and extensive I/O in a compact 484-BBGA package, targeting commercial designs that need configurable logic density and board-level integration. Its specified core voltage range and surface-mount FCBGA packaging support modern PCB power and assembly practices.

This device is appropriate for engineers and procurement teams seeking a commercial-grade Stratix® III E FPGA with clear, verifiable specifications for logic capacity, memory, I/O, package type, and operating conditions—offering a balance of integration and scalability for mid- to high-density digital designs.

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