EP3SE50F484C4N

The EP3SE50F484C4N is an Intel Stratix® III E field-programmable gate array (FPGA) offering high-density programmable logic in a 484-ball BGA package. It provides 47,500 logic elements, approximately 5.76 Mbits of embedded memory, and up to 296 general-purpose I/Os for designs that require substantial on-chip resources and flexible I/O integration.

Designed for commercial-grade applications, this surface-mount FCBGA device operates from a core supply range of 860 mV to 1.15 V and supports an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  47,500 logic elements delivering programmable logic capacity for complex glue logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support data buffering, frame storage, and local memory needs without external RAM.
• I/O Density  Up to 296 I/O pins to support multiple parallel interfaces, wide buses, and mixed-signal front-end connectivity.
• Power  Core voltage supply range of 860 mV to 1.15 V to match system power-rail requirements and support standard FPGA core voltages.
• Package & Mounting  484-ball FCBGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Commercial Grade Operation  Rated for 0 °C to 85 °C operating temperature and specified as commercial grade for typical commercial applications.
• Environmental Compliance  RoHS compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• High-density I/O systems  Use the device’s 296 I/Os to implement multi-channel interfaces, wide parallel buses, and protocol bridging on a single FPGA.
• Embedded memory-intensive logic  Leverage approximately 5.76 Mbits of on-chip RAM for buffering, packet storage, and other local-memory needs without immediate external memory.
• Custom compute and control  Deploy the 47,500 logic elements to realize application-specific datapaths, control logic, and hardware acceleration functions.

Unique Advantages

• Substantial programmable capacity: 47,500 logic elements provide room for large state machines, parallel pipelines, and complex control logic while keeping integration on a single device.
• Significant on-chip RAM: Approximately 5.76 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks, simplifying board design.
• High I/O count: 296 I/Os enable integration of multiple interfaces and sensors without additional I/O expanders, reducing BOM and board complexity.
• Compact surface-mount package: 484-ball FCBGA (23×23) supports high-density PCB layouts where board space and routing require a BGA solution.
• Commercial-grade suitability: Specified for 0 °C to 85 °C operation and RoHS compliant manufacturing for standard commercial product deployments.

Why Choose EP3SE50F484C4N?

The EP3SE50F484C4N balances sizable programmable logic, embedded memory, and extensive I/O connectivity in a compact 484-ball FCBGA package, making it well suited for commercial designs that require integrated, programmable hardware capacity. Its combination of 47,500 logic elements and approximately 5.76 Mbits of on-chip RAM supports complex control, buffering, and data-processing tasks on a single device.

This FPGA is appropriate for engineering teams and procurement focused on commercial applications that need high I/O density, substantial on-chip memory, and a compact surface-mount package. Its RoHS compliance and defined operating ranges help simplify qualification and manufacturing decisions.

Request a quote or submit a product inquiry to receive pricing, availability, and assistance specifying EP3SE50F484C4N for your next design.