EP3SE50F484I4

IC FPGA 296 I/O 484FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 296 5760000 47500 484-BBGA, FCBGA

Quantity 1,679 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O296Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5760000

Overview of EP3SE50F484I4 – Stratix® III E FPGA, 47,500 logic elements, 484-FBGA

The EP3SE50F484I4 is a Stratix® III E field programmable gate array (FPGA) manufactured by Intel. It delivers a high-density, industrial-grade programmable logic solution with significant on-chip memory and broad I/O capability for complex digital designs.

With 47,500 logic elements and approximately 5.76 Mbits of embedded memory, the device is optimized for applications that require dense logic, substantial local RAM, and flexible interfacing, while supporting a wide industrial temperature range and low-voltage core operation.

Key Features

  • Logic Capacity  47,500 logic elements and 1,900 LABs provide substantial programmable logic resources for complex designs.
  • Embedded Memory  Approximately 5.76 Mbits of total on-chip RAM to support local buffering, state machines, and data processing without immediate reliance on external memory.
  • I/O Count  296 dedicated I/O pins to accommodate multiple interfaces and parallel signal routing requirements.
  • Power  Core supply specified from 0.86 V to 1.15 V to align with low-voltage system domains.
  • Package and Mounting  Supplied in a 484-BBGA (FCBGA) package, listed as 484-FBGA (23×23), optimized for surface-mount assembly and compact board layouts.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
  • Compliance  RoHS compliant to support environmental requirements.

Typical Applications

  • High-density digital logic  Implement complex state machines, custom datapaths, and parallel processing blocks using the device's 47,500 logic elements and 1,900 LABs.
  • Embedded memory-intensive designs  Use the approximately 5.76 Mbits of on-chip RAM for buffering, lookup tables, and local data storage to reduce external memory dependence.
  • Multi-interface systems  Leverage 296 I/O pins to connect to multiple peripherals, sensors, or high-bandwidth interfaces on a single FPGA.
  • Industrial equipment  Deploy in systems requiring extended temperature operation thanks to the −40 °C to 100 °C rated range and industrial-grade classification.

Unique Advantages

  • Highly integrated logic and memory: Combines 47,500 logic elements with approximately 5.76 Mbits of embedded RAM to minimize external components and simplify board design.
  • Extensive I/O capacity: 296 I/O pins enable multiple parallel interfaces and flexible signal routing for system-level integration.
  • Industrial robustness: Specified operation from −40 °C to 100 °C and industrial grade classification support deployment in harsher operating environments.
  • Compact, surface-mount package: 484-FBGA (23×23) package supports high-density PCB layouts while enabling reliable surface-mount assembly.
  • Low-voltage core support: 0.86 V to 1.15 V supply range aligns with modern low-voltage power domains to help optimize system power budgets.
  • RoHS compliant: Conforms to RoHS to meet common environmental and regulatory requirements.

Why Choose EP3SE50F484I4?

The EP3SE50F484I4 positions itself as a high-density, industrial-grade FPGA option for engineers who need substantial on-chip logic and memory combined with flexible I/O and compact packaging. Its specifications—47,500 logic elements, approximately 5.76 Mbits of embedded RAM, 296 I/O, and a −40 °C to 100 °C operating range—make it suitable for demanding digital designs where integration and thermal tolerance matter.

Manufactured by Intel as part of the Stratix® III E offering, this device provides a balance of integration and robustness for long-term deployments, helping teams reduce external component count and maintain consistent operation across a wide temperature range.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SE50F484I4. Our team can provide the information you need to evaluate this Stratix® III E FPGA for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up