EP3SE50F484I4
| Part Description |
Stratix® III E Field Programmable Gate Array (FPGA) IC 296 5760000 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,679 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5760000 |
Overview of EP3SE50F484I4 – Stratix® III E FPGA, 47,500 logic elements, 484-FBGA
The EP3SE50F484I4 is a Stratix® III E field programmable gate array (FPGA) manufactured by Intel. It delivers a high-density, industrial-grade programmable logic solution with significant on-chip memory and broad I/O capability for complex digital designs.
With 47,500 logic elements and approximately 5.76 Mbits of embedded memory, the device is optimized for applications that require dense logic, substantial local RAM, and flexible interfacing, while supporting a wide industrial temperature range and low-voltage core operation.
Key Features
- Logic Capacity 47,500 logic elements and 1,900 LABs provide substantial programmable logic resources for complex designs.
- Embedded Memory Approximately 5.76 Mbits of total on-chip RAM to support local buffering, state machines, and data processing without immediate reliance on external memory.
- I/O Count 296 dedicated I/O pins to accommodate multiple interfaces and parallel signal routing requirements.
- Power Core supply specified from 0.86 V to 1.15 V to align with low-voltage system domains.
- Package and Mounting Supplied in a 484-BBGA (FCBGA) package, listed as 484-FBGA (23×23), optimized for surface-mount assembly and compact board layouts.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
- Compliance RoHS compliant to support environmental requirements.
Typical Applications
- High-density digital logic Implement complex state machines, custom datapaths, and parallel processing blocks using the device's 47,500 logic elements and 1,900 LABs.
- Embedded memory-intensive designs Use the approximately 5.76 Mbits of on-chip RAM for buffering, lookup tables, and local data storage to reduce external memory dependence.
- Multi-interface systems Leverage 296 I/O pins to connect to multiple peripherals, sensors, or high-bandwidth interfaces on a single FPGA.
- Industrial equipment Deploy in systems requiring extended temperature operation thanks to the −40 °C to 100 °C rated range and industrial-grade classification.
Unique Advantages
- Highly integrated logic and memory: Combines 47,500 logic elements with approximately 5.76 Mbits of embedded RAM to minimize external components and simplify board design.
- Extensive I/O capacity: 296 I/O pins enable multiple parallel interfaces and flexible signal routing for system-level integration.
- Industrial robustness: Specified operation from −40 °C to 100 °C and industrial grade classification support deployment in harsher operating environments.
- Compact, surface-mount package: 484-FBGA (23×23) package supports high-density PCB layouts while enabling reliable surface-mount assembly.
- Low-voltage core support: 0.86 V to 1.15 V supply range aligns with modern low-voltage power domains to help optimize system power budgets.
- RoHS compliant: Conforms to RoHS to meet common environmental and regulatory requirements.
Why Choose EP3SE50F484I4?
The EP3SE50F484I4 positions itself as a high-density, industrial-grade FPGA option for engineers who need substantial on-chip logic and memory combined with flexible I/O and compact packaging. Its specifications—47,500 logic elements, approximately 5.76 Mbits of embedded RAM, 296 I/O, and a −40 °C to 100 °C operating range—make it suitable for demanding digital designs where integration and thermal tolerance matter.
Manufactured by Intel as part of the Stratix® III E offering, this device provides a balance of integration and robustness for long-term deployments, helping teams reduce external component count and maintain consistent operation across a wide temperature range.
Request a quote or submit an inquiry to receive pricing and availability for the EP3SE50F484I4. Our team can provide the information you need to evaluate this Stratix® III E FPGA for your next design.

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