EP3SE50F484I4G

The EP3SE50F484I4G is an Intel Stratix® III E field-programmable gate array (FPGA) in a 484-BBGA FCBGA package targeted at memory- and multiplier-rich, data-centric applications. It combines a high logic capacity with significant on-chip memory and dedicated DSP resources for demanding signal processing, packet processing, and high‑speed interface designs.

This industrial-grade device supports a wide operating temperature range and a selectable core voltage window, enabling deployment in systems that require sustained performance across harsh environments while providing power-management flexibility.

Key Features

• Logic Capacity  47,500 logic elements provide substantial programmable logic resources for complex state machines, control logic, and custom datapaths.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to implement buffers, FIFOs, and intermediate storage; family architectures support TriMatrix memory for flexible dual-port memory implementations.
• High‑Performance DSP  Dedicated DSP/multiplier structures in the Stratix III family support a range of multiplier sizes and multiply-accumulate functions for real-time signal processing and acceleration tasks.
• I/O and High‑Speed Interfaces  296 user I/O pins with support for dynamic on-chip termination, high-speed differential signaling, serializer/deserializer (SERDES) functions and dynamic phase alignment for robust high-speed links.
• Clocking and PLLs  Multiple global, regional, and peripheral clocks with up to 12 PLLs per device (family-level) enable complex clocking schemes and clock synthesis for multi-rate designs.
• Power Management  Selectable core voltage and Programmable Power Technology (family-level) provide granular control over performance versus power consumption; device core operates within a 0.86 V to 1.15 V supply range.
• Security and Reliability  Family-level support for 256-bit AES configuration encryption plus built-in CRC and ECC circuitry help protect configuration and user memory against corruption and soft errors.
• Package and Thermal  484-BBGA (484-FBGA, 23×23) surface-mount package; rated for industrial operation from −40°C to 100°C.

Typical Applications

• High‑performance DSP systems  Use the device’s dedicated multipliers and on-chip memory for FIR filters, FFTs, and other real-time signal-processing pipelines.
• High‑speed memory controllers  Implement DDR/DDR2/DDR3 and other external-memory interfaces using the device’s modular I/O banks and dedicated DQS logic (family-level support detailed in the Stratix III handbook).
• Network and communications equipment  Build packet processors, line cards, and protocol bridges leveraging high-speed differential I/O, SERDES, and dynamic phase alignment.
• Embedded compute and control  Integrate custom logic, interface handling, and embedded processors for industrial control, instrumentation, and measurement systems.

Unique Advantages

• Substantial programmable logic  47,500 logic elements let you consolidate functions into a single FPGA, reducing component count and board complexity.
• Significant on‑chip RAM  Approximately 5.76 Mbits of embedded memory supports deep buffering and high-throughput data paths without relying solely on external memory.
• Dedicated DSP resources  On-chip multipliers and DSP blocks accelerate math-intensive workloads and offload processing from general-purpose processors.
• Industrial temperature rating  −40°C to 100°C operating range allows deployment in temperature‑challenging environments common in industrial applications.
• Flexible power/performance trade-offs  Selectable core voltage and programmable power features allow designers to tune device behavior for performance or energy efficiency.
• Robust configuration and data integrity  Family-level AES encryption, CRC, and ECC support add layers of protection for configuration and user data, improving system reliability.

Why Choose EP3SE50F484I4G?

The EP3SE50F484I4G places a balanced combination of logic, embedded memory, and DSP capability into a compact 484-BBGA industrial package. It is well suited for designers building data-centric systems that require substantial on-chip resources, flexible high-speed I/O, and configurable power/performance trade-offs.

For engineering teams targeting industrial communications, signal processing, or memory‑intensive applications, this Stratix III E device offers a proven family architecture with features aimed at integration, reliability, and performance scalability.

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