EP3SE50F484I4LG

The EP3SE50F484I4LG is a Stratix III E family FPGA offered in a 484-FBGA (23×23) surface-mount package. As a memory- and multiplier-rich device within the Stratix III family, it targets data-centric designs that require substantial embedded memory, high logic density, and flexible I/O integration.

Built on the Stratix III device architecture, the device combines approximately 47,500 logic elements with approximately 5.76 Mbits of embedded RAM, along with programmable power and selectable core-voltage capabilities to balance performance and power for industrial applications.

Key Features

• Logic Capacity  Approximately 47,500 logic elements for implementing complex logic, control, and DSP functions.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive datapaths.
• I/O Density  296 user I/O pins arranged for flexible interfacing with modular I/O bank support.
• High-performance DSP Support  Family-level DSP and multiplier resources for dense signal processing and arithmetic operations (Stratix III E family focus on memory- and multiplier-rich architectures).
• Power and Voltage  Selectable core voltage operation with a supply range of 0.86 V to 1.15 V to enable trade-offs between power and performance.
• Package and Mounting  484-BBGA (FCBGA) package, supplier device package 484-FBGA (23×23); surface-mount mounting type for compact board-level integration.
• Operating Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Security and Reliability  Family features include optional 256-bit AES encryption for configuration bitstream security, CRC-based configuration memory checking, and ECC support for embedded memory blocks.
• Clocking and Timing  Family-level support for multiple global and regional clocks and up to 12 PLLs to manage complex clocking and serialization requirements.

Typical Applications

• High-performance networking  Use the device’s logic density, on-chip RAM, and high-speed I/O to implement packet processors, protocol bridges, and network acceleration functions.
• Data acquisition and signal processing  Embedded memory and DSP resources enable buffering, filtering, and real-time signal pipeline implementations.
• Memory interface controllers  Modular I/O and family-level memory-interface support make the device suitable for implementing DDR/DDR2/DDR3 controller logic and high-bandwidth memory subsystems.
• Industrial automation  Industrial temperature rating and robust packaging support control, motion, and instrumentation designs operating in harsh environments.

Unique Advantages

• High on‑chip memory capacity: Approximately 5.76 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design for buffer- and packet-intensive systems.
• Substantial logic resources: ~47,500 logic elements provide the headroom to integrate control, datapath, and interface logic into a single device.
• Flexible power scaling: Selectable core voltage and family Programmable Power Technology enable designers to tune power consumption versus performance.
• Robust security and error protection: Built-in AES configuration encryption, CRC configuration checks, and ECC for memory blocks help protect IP and improve system reliability.
• Industrial temperature tolerance: Specified −40 °C to 100 °C operation supports deployments in a wide range of environments.
• Compact, surface-mount package: 484-FBGA (23×23) package enables dense PCB integration for space-constrained systems.

Why Choose EP3SE50F484I4LG?

The EP3SE50F484I4LG combines substantial logic capacity and embedded memory within the Stratix III E family architecture, making it well suited for data-centric and signal-processing applications that demand integrated memory, DSP resources, and flexible I/O. Its selectable core voltage and family power-management features help engineers optimize power versus performance for industrial deployments.

This device is appropriate for design teams seeking a scalable FPGA platform with built-in security and reliability features, a high I/O count, and industrial temperature support, enabling lower system BOM and tighter integration of complex functions on a single device.

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