EP3SE50F780C2G

The EP3SE50F780C2G is an Intel Stratix® III E field programmable gate array (FPGA) offered in a 780-BBGA (29×29 FCBGA) package. As a memory- and multiplier-rich member of the Stratix III family, this commercial-grade device targets data-centric and high‑performance logic, DSP, and embedded applications.

Designed for surface-mount deployment, the device provides a combination of dense logic (47,500 logic elements), approximately 5.76 Mbits of embedded memory, and a high channel I/O count to support complex, high‑bandwidth system designs.

Key Features

• Logic Capacity  47,500 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support FIFOs, buffers, and packet or data processing functions.
• I/O Density  488 user I/O pins in a modular I/O arrangement to support diverse interface requirements.
• Package & Mounting  780-BBGA (FCBGA), supplier package 780-FBGA (29×29); surface-mount device for board-level integration.
• Core Voltage Range  Device supply specified from 860 mV to 1.15 V to align with core power domains.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Family-Level DSP & Clocking  As a Stratix III device, the family provides high‑speed DSP blocks and extensive clocking resources (family features include multiple PLLs and global/regional/peripheral clocks) to support signal processing and timing-critical designs.
• Reliability & Security (Family Features)  Stratix III family devices include options such as configuration memory CRC and ECC for on-chip memory protection and optional 256‑bit AES encryption for configuration bitstream security.
• Standards & Signal Integrity (Family Features)  Family architecture provides dynamic on-chip termination, output delay and current strength control, and high-speed SERDES support for robust high-speed interfaces.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Data-Centric Processing  High-throughput packet processing, data aggregation, and stream manipulation where embedded memory and DSP resources accelerate data flows.
• High-Performance DSP  Signal processing tasks such as filtering, transforms, and multiply-accumulate operations leveraging family DSP block capabilities.
• Interface & Protocol Bridging  Implementing complex protocol conversion or multi-interface bridging using the device's high I/O count and modular I/O architecture.
• Embedded Systems  Custom logic and co-processing functions for embedded applications requiring configurable hardware acceleration and on-chip memory.

Unique Advantages

• Substantial Logic Density:  47,500 logic elements enable integration of large custom functions and control logic into a single device, reducing board-level component count.
• Significant On-Chip Memory:  Approximately 5.76 Mbits of embedded RAM supports large buffers and on-chip data structures, minimizing external memory dependence.
• High I/O Count:  488 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front-ends.
• Commercial Temperature Range:  Operation across 0 °C to 85 °C fits a wide range of standard commercial applications and environments.
• Family-Level Performance Features:  Stratix III architecture offers DSP blocks, configurable clocking, and SERDES support—useful for high-speed processing and timing-critical designs.
• Compliance & Integration:  RoHS compliance and a compact 780-BBGA surface-mount package aid modern assembly and environmental requirements.

Why Choose EP3SE50F780C2G?

The EP3SE50F780C2G delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact FCBGA package, making it well suited for designers building data‑centric, DSP-heavy, or interface-intensive systems. As part of the Stratix III E family, it benefits from architecture features aimed at high-performance and reliable operation, including family-level DSP resources, clocking flexibility, and configuration integrity mechanisms.

This device is appropriate for commercial applications requiring dense programmable logic and on-chip memory while maintaining standard operating temperature and supply ranges. Its combination of features supports scalable designs and longer-term product evolution within the Stratix III family ecosystem.

If you would like pricing or availability, request a quote or submit a purchase inquiry for EP3SE50F780C2G and include your desired quantity and delivery timeline.