EP3SE50F780C2N

The EP3SE50F780C2N is a Stratix® III E field programmable gate array (FPGA) in a 780-ball BGA package (FCBGA). It provides a large programmable fabric with 47,500 logic elements and approximately 5.76 Mbits of embedded memory, paired with a 488-pin I/O count for dense system integration.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 0.860 V to 1.15 V core supply and is specified for an ambient operating range of 0 °C to 85 °C, offering a combination of logic capacity, on-chip memory, and I/O density for complex, high-pin-count designs.

Key Features

• Core Logic  47,500 logic elements provide substantial programmable capacity for complex digital designs and custom logic implementation.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM supports buffering, packet processing, and data path storage without external memory for many use cases.
• I/O Density  488 user I/O pins enable extensive interfacing to external peripherals, sensors, and high-pin-count system connectors.
• Power  Core voltage supply range of 0.860 V to 1.15 V allows integration into low-voltage supply domains common in modern systems.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface-mount mounting type supports standard PCB assembly flows.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for a broad range of non-industrial applications.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Unique Advantages

• Large Programmable Capacity: 47,500 logic elements enable implementation of sizable custom logic blocks and complex finite-state machines without external logic.
• Substantial On-Chip Memory: Approximately 5.76 Mbits of embedded RAM reduces the need for external memory in many buffering and storage scenarios, simplifying system design.
• High I/O Count: 488 I/O pins provide flexibility for multi-interface designs, high-channel-count sensor arrays, or wide data buses.
• Compact BGA Footprint: 780-ball FCBGA (29×29) packaging offers a high-pin-count solution in a single compact surface-mount package for space-constrained boards.
• Low-Voltage Core: Core operation from 0.860 V to 1.15 V supports integration with modern low-voltage power domains.
• Regulatory Compliance: RoHS compliance simplifies procurement and environmental compliance for assembled products.

Why Choose EP3SE50F780C2N?

The EP3SE50F780C2N combines a substantial logic element count, several megabits of embedded RAM, and a high I/O count in a single commercial-grade FCBGA package. This balance of logic density, memory, and connectivity makes it well suited to designers who need extensive on-chip resources and many external interfaces while maintaining a compact board footprint.

Backed by available technical documentation, the EP3SE50F780C2N is appropriate for development teams seeking a verified FPGA building block for commercial applications where core voltage limits and an ambient operating range of 0 °C to 85 °C meet system requirements.

Request a quote or contact sales to discuss pricing, availability, and how the EP3SE50F780C2N can meet your project requirements.