EP3SE50F780C3
| Part Description |
Stratix® III E Field Programmable Gate Array (FPGA) IC 488 5760000 47500 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,376 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5760000 |
Overview of EP3SE50F780C3 – Stratix® III E FPGA, 47,500 logic elements
The EP3SE50F780C3 is a commercial-grade Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel. It provides 47,500 logic elements, approximately 5.76 Mbits of embedded memory, and 488 user I/Os in a 780-BBGA FCBGA surface-mount package.
Designed for commercial programmable-logic applications, the device combines substantial logic and on-chip RAM capacity with a high I/O count and a compact 780-FBGA (29×29) package, while operating within a core voltage range of 860 mV to 1.15 V and a temperature range of 0 °C to 85 °C.
Key Features
- Core and Logic Capacity 47,500 logic elements provide the programmable fabric for custom digital logic implementations.
- Embedded Memory Approximately 5.76 Mbits of on-chip RAM to support buffering, state storage, and data processing functions.
- High I/O Count 488 I/O pins to accommodate dense external interfacing and board-level connectivity.
- Power and Voltage Core supply range from 860 mV to 1.15 V to match system-level power requirements.
- Package and Mounting 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for board-level integration.
- Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Unique Advantages
- Large programmable capacity: 47,500 logic elements enable implementation of complex custom logic without external processors for many designs.
- Substantial on-chip memory: Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate data storage.
- Extensive I/O availability: 488 I/Os support interfacing to multiple peripherals, buses, and board-level signals.
- Compact, mount-ready package: The 780-FBGA (29×29) surface-mount package supports high-density board layouts while maintaining signal access and reliability.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant to meet common commercial deployment and environmental requirements.
- Low-voltage core operation: Core supply from 860 mV to 1.15 V helps align with contemporary low-voltage system designs.
Why Choose EP3SE50F780C3?
The EP3SE50F780C3 delivers a balance of logic capacity, embedded memory, and I/O density in a compact FCBGA package, making it well suited for commercial programmable-logic designs that require integration and board-level efficiency. As a Stratix® III E family device from Intel, it provides a predictable hardware platform with specified electrical and thermal operating ranges.
Choose this part when your design requires a commercially graded FPGA with tens of thousands of logic elements, multiple megabits of on-chip RAM, and a high pin count in a surface-mount 780-FBGA package to simplify system integration and reduce external BOM complexity.
Request a quote or submit an inquiry to receive pricing and availability for the EP3SE50F780C3.

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