EP3SE50F780C3

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 488 5760000 47500 780-BBGA, FCBGA

Quantity 1,376 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5760000

Overview of EP3SE50F780C3 – Stratix® III E FPGA, 47,500 logic elements

The EP3SE50F780C3 is a commercial-grade Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel. It provides 47,500 logic elements, approximately 5.76 Mbits of embedded memory, and 488 user I/Os in a 780-BBGA FCBGA surface-mount package.

Designed for commercial programmable-logic applications, the device combines substantial logic and on-chip RAM capacity with a high I/O count and a compact 780-FBGA (29×29) package, while operating within a core voltage range of 860 mV to 1.15 V and a temperature range of 0 °C to 85 °C.

Key Features

  • Core and Logic Capacity  47,500 logic elements provide the programmable fabric for custom digital logic implementations.
  • Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, state storage, and data processing functions.
  • High I/O Count  488 I/O pins to accommodate dense external interfacing and board-level connectivity.
  • Power and Voltage  Core supply range from 860 mV to 1.15 V to match system-level power requirements.
  • Package and Mounting  780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for board-level integration.
  • Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Unique Advantages

  • Large programmable capacity: 47,500 logic elements enable implementation of complex custom logic without external processors for many designs.
  • Substantial on-chip memory: Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate data storage.
  • Extensive I/O availability: 488 I/Os support interfacing to multiple peripherals, buses, and board-level signals.
  • Compact, mount-ready package: The 780-FBGA (29×29) surface-mount package supports high-density board layouts while maintaining signal access and reliability.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant to meet common commercial deployment and environmental requirements.
  • Low-voltage core operation: Core supply from 860 mV to 1.15 V helps align with contemporary low-voltage system designs.

Why Choose EP3SE50F780C3?

The EP3SE50F780C3 delivers a balance of logic capacity, embedded memory, and I/O density in a compact FCBGA package, making it well suited for commercial programmable-logic designs that require integration and board-level efficiency. As a Stratix® III E family device from Intel, it provides a predictable hardware platform with specified electrical and thermal operating ranges.

Choose this part when your design requires a commercially graded FPGA with tens of thousands of logic elements, multiple megabits of on-chip RAM, and a high pin count in a surface-mount 780-FBGA package to simplify system integration and reduce external BOM complexity.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SE50F780C3.

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