EP3SE50F780C3N

The EP3SE50F780C3N is an Intel Stratix® III E field-programmable gate array (FPGA) in a 780-ball FCBGA package. It combines high logic capacity and on-chip embedded memory with a comprehensive I/O complement for complex digital system integration.

Designed for commercial-grade applications, the device targets systems that require significant programmable logic, substantial embedded memory, and flexible I/O connectivity while operating within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — Contains 47,500 logic elements to implement complex custom logic, state machines, and control functions.
• Embedded Memory — Provides approximately 5.76 Mbits of on-chip RAM suitable for buffers, FIFOs, and local storage.
• I/O Resources — 488 user I/Os to support wide parallel buses, multiple interfaces, and board-level connectivity.
• Device Family Architecture — Part of the Stratix III device family, which includes TriMatrix embedded memory blocks, DSP blocks, and clock networks with PLLs, enabling integrated memory, DSP, and clocking resources.
• External Memory & High-Speed Interfaces — The device supports external memory interfaces and high-speed differential I/O structures as described in the Stratix III device handbook.
• Power Supply Range — Core voltage range of 0.860 V to 1.15 V for compatibility with Stratix III E core power requirements.
• Package & Mounting — 780-ball FCBGA (29 × 29) surface-mount package (780-BBGA, FCBGA) for compact board-level integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and specified as commercial grade.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-performance embedded processing — Use the device’s large logic capacity and DSP resources for custom signal processing and algorithm acceleration.
• Memory interface controllers — Implement external memory controllers and wide parallel memory buses leveraging on-chip memory and I/O resources.
• High-density I/O aggregation — Consolidate multiple peripheral interfaces or wide parallel buses using the device’s 488 I/Os.
• System prototyping and integration — Rapidly prototype complex digital subsystems that require reprogrammable logic, embedded memory, and flexible clocking.

Unique Advantages

• High logic density: 47,500 logic elements provide the capacity to implement complex digital designs without immediate need for multiple devices.
• Substantial embedded memory: Approximately 5.76 Mbits of on-chip RAM reduces external memory dependency for many buffering and storage tasks.
• Extensive I/O flexibility: 488 I/Os enable broad connectivity options for parallel interfaces, peripherals, and board-level signaling.
• Integrated architectural features: Stratix III family elements such as TriMatrix memory blocks, DSP blocks, and PLL-based clock networks streamline implementation of memory, DSP, and timing functions.
• Compact board footprint: 780-ball FCBGA surface-mount package supports dense PCB layouts while providing numerous I/Os.
• Commercial temperature suitability: Specified 0 °C to 85 °C operation for mainstream commercial applications.

Why Choose EP3SE50F780C3N?

The EP3SE50F780C3N delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in a single commercial-grade Stratix III E FPGA. Its architecture and on-chip resources are suited to designers building complex digital systems that require integrated DSP, memory, and clock management features.

This device is appropriate for development teams and OEMs seeking a scalable, reprogrammable platform for applications that demand significant programmable logic and memory resources, paired with a compact FCBGA package and standard commercial operating range.

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