EP3SE50F780C4LG

The EP3SE50F780C4LG is a Stratix® III E field programmable gate array (FPGA) in a 780-BBGA FCBGA package, optimized for memory- and multiplier-rich, data-centric designs. It combines a high logic capacity with substantial embedded RAM and modular I/O to support high-performance logic, DSP, and embedded system integration in commercial-temperature applications.

Designed for configurable high-throughput tasks, this device targets networking, signal processing, and embedded compute applications that require significant logic resources, plentiful I/O, and power optimization features available across the Stratix III family.

Key Features

• Logic Capacity — 47,500 logic elements for complex combinational and sequential logic implementation.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
• I/O Density — 488 user I/O pins in a modular bank structure to support a broad range of interfaces and parallel buses.
• Package & Mounting — 780-BBGA (FCBGA) package, supplier device package 780-FBGA (29 × 29), surface-mount for compact board integration.
• Supply Voltage — Core voltage range from 860 mV to 1.15 V, enabling selectable core voltage operation for power/performance tradeoffs.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for commercial-grade systems.
• Family-Level Capabilities — Stratix III family features such as Programmable Power Technology, selectable core voltage, multiple PLLs, high-speed SERDES and clocking resources, AES configuration encryption, and on-chip error detection and ECC for memory (as described in the Stratix III device documentation).

Typical Applications

• High‑Performance Networking — Implement packet processing, protocol bridging, and interfaces for high data-rate network systems using the device’s high I/O density and family-level SERDES/clocking features.
• Digital Signal Processing — Deploy DSP chains, filters, and multiplier-accumulate functions using the Stratix III E family’s memory- and multiplier-rich architecture.
• Memory Interface Controllers — Build DDR/DDR2/DDR3 and other external memory controllers leveraging on-chip memory resources and dedicated I/O support described in the Stratix III documentation.
• Embedded Systems & Prototyping — Use as a programmable alternative to custom ASICs for embedded logic, control, and prototype designs that require reprogrammability and high logic capacity.

Unique Advantages

• High integration level: 47,500 logic elements and substantial embedded RAM reduce external component count and simplify board-level design.
• Flexible I/O and packaging: 488 I/Os in a 780-BBGA FCBGA 29 × 29 footprint allow dense routing and support for multiple parallel and high-speed interfaces.
• Power/performance trade-offs: Selectable core voltage (860 mV–1.15 V) and family Programmable Power Technology enable designers to tune for performance or lower power consumption.
• Security and reliability features: Family-level support for AES configuration encryption, CRC configuration checks, and ECC for embedded memory help protect designs and improve system availability.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial applications and deployments.

Why Choose EP3SE50F780C4LG?

The EP3SE50F780C4LG delivers a balance of logic density, embedded memory, and I/O scalability within the Stratix III E family architecture—making it well suited for data-centric, high-throughput applications that need programmable, reconfigurable logic. Its selectable core voltage and family power-management features provide designers with options to optimize performance and power for a given design point.

With Intel’s Stratix III family capabilities documented for high-speed I/O, PLL/clocking resources, on-chip security, and memory reliability features, this device is appropriate for teams developing advanced networking, DSP, and embedded compute solutions that require a robust, commercially graded FPGA platform.

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