EP3SE50F780C4LN

The EP3SE50F780C4LN is an Intel Stratix® III E field programmable gate array (FPGA) provided in a 780‑ball FCBGA package (29×29). It delivers high-density programmable logic with 47,500 logic elements, approximately 5.76 Mbits of embedded memory, and up to 488 user I/O pins for demanding commercial applications.

Designed for systems that require significant logic capacity, substantial on‑chip RAM, and a large number of I/O connections, this device supports designs operating across a core voltage range of 0.86 V to 1.15 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 47,500 logic elements provide dense programmable logic resources for complex digital designs.
• Embedded Memory Approximately 5.76 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory in many use cases.
• I/O Capacity Up to 488 user I/O pins to support multiple interfaces and parallel data paths.
• Power and Voltage Core supply range from 0.860 V to 1.15 V to accommodate target system power domains and FPGA core requirements.
• Package 780‑ball BGA (FCBGA) with supplier package dimension 29×29 mm for high‑pin‑count integration in space‑efficient footprints.
• Operating Temperature Commercial temperature grade rated from 0 °C to 85 °C for typical commercial applications.
• Regulatory RoHS compliant.

Typical Applications

• High‑density digital systems — Implements large combinational and sequential logic networks where 47,500 logic elements are required for custom datapaths and control logic.
• Memory‑intensive designs — Uses the approximately 5.76 Mbits of embedded RAM for buffering, packet storage, and local data processing without depending solely on external memory.
• I/O‑rich interface bridging — Leverages up to 488 I/O pins to aggregate multiple parallel/serial interfaces, protocol bridging, or multi‑lane data aggregation.
• Prototyping and system integration — Serves as a platform for validating complex system logic and integrating multiple subsystems within a single programmable device.

Unique Advantages

• High logic density: 47,500 logic elements enable consolidation of complex functions and reduced external glue logic.
• Significant on‑chip memory: Approximately 5.76 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage needs.
• Large I/O complement: 488 user I/Os support extensive connectivity and multi‑interface designs without external multiplexing.
• Compact, high‑pin‑count package: 780‑ball FCBGA (29×29) balances pin count and board area for dense system integration.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments.
• Flexible core voltage: Core supply range of 0.860 V to 1.15 V supports design compatibility across different power architectures.

Why Choose EP3SE50F780C4LN?

The EP3SE50F780C4LN combines substantial logic capacity, meaningful embedded memory, and a high I/O count in a compact 780‑ball FCBGA package, making it well suited for commercial designs that require on‑board integration of complex digital functions and multi‑interface connectivity. Its electrical and thermal specifications allow designers to plan around a clearly defined operating window and supply domain.

This device is intended for engineers and system designers who need dense programmable resources and embedded memory to consolidate functions, streamline board designs, and accelerate development cycles within commercial temperature environments.

Request a quote or submit a pricing inquiry today to evaluate EP3SE50F780C4LN for your next high‑density FPGA design.