EP3SE50F780I3G

The EP3SE50F780I3G is a Stratix® III E field programmable gate array (FPGA) that delivers a balance of logic density, embedded memory and extensive I/O for complex digital designs. With 47,500 logic elements and approximately 5.76 Mbits of embedded memory, it is targeted at designs that require significant on-chip resources and flexible I/O integration.

Packaged in a 780-BBGA (supplier package: 780-FBGA (29x29)) and rated for industrial operation, this device supports core supply voltages from 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, making it suitable for robust, environment-tolerant deployments.

Key Features

• Core Logic  Provides 47,500 logic elements for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support data buffering, FIFOs and state storage within the FPGA fabric.
• High I/O Count  Up to 488 I/O pins to support wide parallel interfaces, multiple peripherals and flexible board-level connectivity.
• Power and Voltage  Core supply range from 860 mV to 1.15 V, enabling compatibility with systems that require low-voltage FPGA cores.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C for use in temperature-challenging environments.
• Package and Mounting  780-BBGA, FCBGA package (supplier device package: 780-FBGA (29x29)) in a surface-mount form factor for compact board integration.
• Regulatory  RoHS compliant, supporting lead-free manufacturing and environmental requirements.

Typical Applications

• High-density digital processing  Implement custom datapaths, protocol processing or hardware accelerators using the device's 47,500 logic elements and embedded memory.
• I/O-intensive systems  Support systems requiring large numbers of external interfaces with up to 488 I/O pins for parallel buses and multiple peripherals.
• Industrial control and automation  Designed for industrial-grade deployments with an operating range of −40 °C to 100 °C and surface-mount packaging for PCB integration.

Unique Advantages

• Substantial on-chip resources: The combination of 47,500 logic elements and approximately 5.76 Mbits of embedded memory reduces the need for external logic and RAM, simplifying board design.
• Extensive connectivity: Up to 488 I/O pins enable broad peripheral support and flexible interface options without additional multiplexing logic.
• Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount 780-BBGA package suitable for demanding environments.
• Low-voltage core support: Core supply range of 860 mV to 1.15 V aligns with modern low-voltage system architectures.
• RoHS compliance: Supports lead-free manufacturing processes and environmental compliance requirements.

Why Choose EP3SE50F780I3G?

The EP3SE50F780I3G positions itself as a high-capacity Stratix® III E FPGA offering a substantial combination of logic elements, embedded memory and I/O density in an industrial-grade package. Its electrical and thermal ratings make it suitable for designs that require robust operation and significant on-chip resources.

This device is a strong fit for engineers developing complex digital systems that need integrated memory, broad I/O and a compact BGA package. Its specification-driven balance of performance and integration supports scalable designs where minimizing external components and maximizing on-chip capability are priorities.

Request a quote or submit a pricing inquiry to receive availability and tailored pricing information for the EP3SE50F780I3G. Our team can provide lead-time details and assist with volume and procurement options.