EP3SE50F780I4L

The EP3SE50F780I4L is an Intel Stratix® III E field programmable gate array (FPGA) in a 780-ball FCBGA package. It delivers high programmable logic density with substantial embedded memory and a large I/O count for complex, industrial-grade digital designs.

With approximately 47,500 logic elements, about 5.76 Mbits of embedded memory and 488 user I/Os, this device targets applications that require dense logic integration, significant on-chip RAM and broad interfacing capability while operating across an industrial temperature range.

Key Features

• Core Capacity — 1,900 logic array blocks supporting approximately 47,500 logic elements to implement complex custom logic and state machines.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM to support buffering, FIFOs and embedded data storage without external memory.
• I/O Resources — 488 user I/Os to support high-density board-level connectivity and multiple parallel interfaces.
• Power Supply — Core voltage supply range from 0.86 V to 1.15 V to match system power-rail designs.
• Package & Mounting — 780-FBGA (29 × 29 mm) FCBGA package in a surface-mount form factor for compact, high-pin-count board layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Implement control logic, signal conditioning and interface bridging in equipment operating across industrial temperature ranges.
• High-Density Digital Processing — Use embedded memory and large logic capacity for data buffering, protocol processing and custom datapaths.
• Multi-Interface Gateways — Leverage 488 I/Os to aggregate and translate between multiple parallel and serial interfaces on a single device.

Unique Advantages

• High Logic Density: Approximately 47,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial On-Chip Memory: About 5.76 Mbits of embedded RAM minimizes dependence on external memory for buffering and real-time data handling.
• Extensive I/O Count: 488 user I/Os provide flexibility for complex interconnects, peripheral expansion and board-level partitioning.
• Industrial Robustness: Specified operation from −40 °C to 100 °C supports deployment in harsh and temperature-variable environments.
• Compact High-Pin Package: 780-FBGA (29×29 mm) FCBGA enables a high-pin-count solution in a space-efficient surface-mount package.

Why Choose EP3SE50F780I4L?

The EP3SE50F780I4L positions itself as a high-density, industrial-grade FPGA option for designers needing substantial logic resources, embedded memory and wide I/O capability in a compact FCBGA package. Its specification set supports consolidation of complex digital functions while maintaining robustness for industrial deployments.

This device is suitable for engineering teams building systems that require on-chip memory, large I/O counts and reliable operation across a broad temperature range, delivering long-term value through integration and reduced board-level complexity.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SE50F780I4L and to discuss how it fits your next design.