EP3SE50F780I4LN

The EP3SE50F780I4LN is a Stratix® III E FPGA offering a mid-range logic capacity and substantial embedded memory in a 780-ball FCBGA package. Designed for industrial applications, it provides a combination of logic resources, I/O density and an extended operating temperature range for deployment in demanding environments.

Key Features

• Core Logic 47,500 logic elements provide programmable resources for custom digital functions and complex control logic.
• Embedded Memory Approximately 5.76 Mbits of on-chip RAM to store buffers, tables and intermediate data without external memory.
• I/O Capacity 488 user I/O pins support extensive peripheral interfacing and multi-channel signal connectivity.
• Power Core supply range from 0.86 V to 1.15 V to match system power architectures and optimize power distribution.
• Package & Mounting 780-ball FBGA (29 × 29 mm) surface-mount package for compact board-level integration and thermal management.
• Temperature & Grade Industrial-grade operation with an operating temperature range of −40 °C to 100 °C for reliable performance in harsh environments.
• Compliance RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• Industrial Control — Implement control logic, motor control interfaces and real-time signal processing using the device's 47,500 logic elements and wide operating temperature range.
• Communication Interfaces — Aggregate and route multiple I/O channels; 488 I/Os enable flexible protocol and device interfacing on a single FPGA.
• Data Buffering and Processing — Use approximately 5.76 Mbits of embedded RAM for packet buffers, FIFOs or lookup tables to reduce external memory dependence.
• Embedded System Integration — Consolidate custom glue logic, peripheral interfaces and sensor aggregation in space-constrained, surface-mount designs.

Unique Advantages

• Substantial Logic Capacity: 47,500 logic elements allow implementation of sizable custom logic blocks and control algorithms without repartitioning across multiple devices.
• On-Chip Memory: Approximately 5.76 Mbits of embedded RAM reduces the need for external memory, simplifying BOM and board layout.
• High I/O Count: 488 I/Os provide the flexibility to connect numerous peripherals, sensors and interfaces directly to the FPGA.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support deployment in challenging thermal environments.
• Compact Surface-Mount Package: 780-ball FBGA (29 × 29 mm) package enables dense PCB integration while supporting thermal and mechanical stability.
• RoHS Compliant: Supports lead-free manufacturing processes and regulatory requirements for many end products.

Why Choose EP3SE50F780I4LN?

The EP3SE50F780I4LN positions itself as a practical choice for designers needing a mid-range FPGA with balanced logic resources, embedded memory and substantial I/O in an industrial-grade package. Its combination of 47,500 logic elements, approximately 5.76 Mbits of on-chip RAM and 488 I/Os supports a broad set of embedded and control-oriented designs while simplifying board-level integration through a 780-ball FBGA surface-mount package.

This part is suited to teams building robust, field-deployable systems that require durable temperature performance and a compact form factor. It delivers long-term value by consolidating logic and memory on-chip, helping reduce component count and simplify system architecture.

Request a quote or submit an inquiry today to discuss availability, lead times and volume pricing for the EP3SE50F780I4LN FPGA.