EP3SE50F780I4LG

The EP3SE50F780I4LG is an industrial-grade Stratix® III E field-programmable gate array (FPGA) in a 780-FBGA (29×29) package. It provides a memory- and multiplier-rich architecture tailored for data-centric, high-performance logic and DSP applications.

With 47,500 logic elements, approximately 5.76 Mbits of on-chip RAM and 488 user I/Os, this device targets designs that require significant embedded memory, dense logic integration, and flexible I/O in an industrial temperature range.

Key Features

• Logic Capacity — 47,500 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for large buffers, FIFOs, and memory-intensive datapaths.
• I/O Density — 488 user I/O pins supporting modular I/O bank structures for flexible interfacing.
• DSP and Multiplier-Rich Architecture — Stratix III E family is optimized for memory- and multiplier-rich applications, suitable for high-performance DSP tasks.
• Power and Core Voltage — Operates with a core supply range of 860 mV to 1.15 V, enabling selectable core voltage operation for power/performance trade-offs.
• Package and Mounting — 780-BBGA / FCBGA package (780-FBGA, 29×29) designed for surface-mount assembly.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Security and Reliability (family features) — Stratix III family includes optional 256-bit AES configuration encryption and configuration memory CRC/ECC features to detect and protect against configuration errors and soft errors.

Typical Applications

• High-Performance DSP — Implement multichannel filters, FFTs, and custom signal chains using the device’s multiplier-rich resources and substantial on-chip memory.
• Data-Centric Interfaces — Buffering, packet processing, and protocol handling where large embedded RAM and dense logic are required.
• Embedded Systems and Accelerators — Hardware acceleration for compute-intensive functions and custom processing pipelines.
• Networking and Communications — High-speed I/O and modular bank architecture for memory interfaces and protocol adaptation in networking equipment.

Unique Advantages

• High logic density: 47,500 logic elements provide headroom for complex, integrated designs and system consolidation.
• Substantial on-chip memory: Approximately 5.76 Mbits of RAM reduces external memory dependency and simplifies memory subsystem design.
• Flexible I/O: 488 I/Os and modular I/O bank architecture support diverse interfacing needs and simplify vertical migration across the device family.
• Industrial temperature rating: −40°C to 100°C operation for deployment in demanding environmental conditions.
• Low-voltage core operation: 860 mV to 1.15 V supply range enables designers to optimize the power/performance balance for their application.
• Security and reliability features: Family-level support for AES configuration encryption, CRC and ECC for configuration and memory integrity.

Why Choose EP3SE50F780I4LG?

The EP3SE50F780I4LG combines large logic capacity, significant embedded memory, and flexible I/O in an industrial-grade Stratix III E FPGA package. It is well suited for engineers building data-centric, DSP-heavy, or memory-intensive systems that require the integration of complex functionality on a single device.

As part of the Stratix III family, it benefits from architecture features aimed at power-managed operation, memory-rich resources and security and reliability mechanisms—making it a practical choice for scalable designs that prioritize performance, integration, and operational robustness.

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