EP3SE80F1152C2G

The EP3SE80F1152C2G is an Intel Stratix III–family Field Programmable Gate Array delivering a balance of programmable logic, on-chip memory, and high-density I/O for performance-oriented embedded and communications designs. Built on the Stratix III architecture and a 65‑nm process, it targets high-performance logic, digital signal processing (DSP) and memory-interface applications where configurable hardware and integration reduce system complexity.

Its device-level specifications include 80,000 logic elements, approximately 6.84 Mbits of embedded memory, and 744 user I/O pins in a 1152‑FBGA package, providing the building blocks for complex, I/O‑heavy designs within commercial temperature and voltage ranges.

Key Features

• Stratix III architecture  Based on the Stratix III device family, which emphasizes high-performance programmable logic and low power through programmable power technology and selectable core voltage options.
• Logic capacity  80,000 logic elements to implement complex control, DSP, and data-path functions.
• Embedded memory  Approximately 6.84 Mbits of on-chip RAM (6,843,392 total RAM bits) to support deep buffering, FIFOs, and on-chip data storage.
• High-density I/O  744 user I/O pins suitable for wide parallel interfaces and multi-bank memory or peripheral connectivity.
• Packaging and mounting  1152‑FBGA (35×35) surface-mount package (1152‑BBGA, FCBGA package case) for compact board integration.
• Power and voltage  Selectable core voltage range from 0.860 V to 1.150 V to support tradeoffs between power and performance.
• Commercial operating range  Rated for 0 °C to 85 °C operation and specified as commercial grade.
• System and reliability features (family-level)  Stratix III family features include optional 256‑bit AES configuration-bit encryption, CRC and ECC support for configuration and memory integrity, PLLs and abundant clocking resources for complex timing domains.

Typical Applications

• High-performance DSP and signal processing  Implement FIR filters, multiply-accumulate pipelines and custom DSP blocks using the device’s large logic and embedded memory resources.
• Networking and communications  Use the high I/O count and Stratix III family support for high-speed differential interfaces to implement protocol handling, packet processing, and I/O aggregation.
• Memory interface controllers  Leverage abundant I/O and on-chip memory to build DDR/DDR2/DDR3 interface logic and memory controllers for bandwidth‑intensive applications.
• Embedded processing and control  Integrate soft-core processors and peripheral logic for system control, protocol bridging, and hardware acceleration.

Unique Advantages

• Substantial logic and memory in one device: 80,000 logic elements plus approximately 6.84 Mbits of embedded RAM reduce external component count and board complexity.
• High I/O density: 744 user I/O pins enable flexible interfacing to multiple peripherals, parallel buses, and memory banks without extensive multiplexing.
• Versatile packaging: 1152‑FBGA (35×35) offers a compact footprint for space-constrained PCBs while supporting surface-mount assembly.
• Configurable power-performance tradeoff: Core voltage range (0.860–1.150 V) supports selectable operation points to optimize power or speed per design requirements.
• Commercial-grade suitability: Operates across 0 °C to 85 °C, matching requirements for a wide range of commercial and telecom applications.
• Security and reliability features (family-level): Stratix III family support for AES encryption, CRC and ECC protects configuration and memory integrity in deployed systems.

Why Choose EP3SE80F1152C2G?

The EP3SE80F1152C2G combines sizable programmable logic, multi-megabit embedded memory, and a high pin-count package to address complex embedded, DSP, and communications designs that need integrated compute and I/O density. Its Stratix III–based architecture and selectable core voltage provide a balance between performance and power that design teams can tune to application needs.

This device is suited for engineers building high-throughput data paths, memory interfaces, and hardware-accelerated functions who require the flexibility of an FPGA plus family-level features for configuration security and system reliability. RoHS compliance and a commercial temperature rating make it appropriate for mainstream electronic products and prototype-through-production deployments.

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