EP3SE80F1152C3G

The EP3SE80F1152C3G is a Stratix III family FPGA offering a high-density, programmable logic platform for computation- and interface-intensive designs. Built for high-performance logic, DSP and embedded applications, this device combines 80,000 logic elements with substantial on-chip memory and a wide complement of I/O to support complex system integration.

Designed for commercial applications, the device provides flexible power and clocking options, advanced on-chip reliability and security features from the Stratix III family, and a compact 1152‑FBGA package for surface-mount assembly.

Key Features

• Logic Capacity — 80,000 logic elements to implement complex state machines, custom datapaths and control logic.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM (TriMatrix family memory architecture) for buffers, FIFOs and local storage.
• High‑Density I/O — 744 user I/O pins to support multiple external interfaces and parallel bus connections.
• Core Power and Process — Selectable core voltage operation with device supply range of 0.860 V to 1.15 V, based on the Stratix III 65 nm process and programmable power technology.
• Clocking and PLLs — Family-level support includes multiple global and regional clocks and up to 12 PLLs for flexible clock synthesis and phase control.
• High‑Speed I/O and SERDES — Stratix III family features include SERDES and dynamic phase alignment circuitry supporting high-speed differential I/O (family-stated up to 1.6 Gbps).
• Security and Reliability — Family features include optional 256-bit AES configuration bitstream security and on-chip CRC/ECC circuitry for configuration and memory error detection/correction.
• Package and Mounting — 1152-FBGA (35 × 35 mm) package, surface-mount, commercial grade with operating range 0 °C to 85 °C.
• Standards and IP Support — Stratix III family supports the Nios II embedded processor and Altera MegaCore IP megafunctions for common interfaces and functions.
• Compliance — RoHS compliant.

Typical Applications

• High‑Performance DSP and Signal Processing — Use the device’s logic density, embedded memory and family DSP capabilities to implement filters, FFTs and real-time signal chains.
• Networking and Communications — Leverage high-speed differential I/O and SERDES support for protocol bridging, packet processing and interface aggregation.
• Memory Interface Controllers — Implement DDR/DDR2/DDR3 or other external memory controllers with available I/O and dedicated memory interface features from the Stratix III family.
• Embedded Systems and Acceleration — Deploy as an application-specific accelerator or as the central programmable logic element in embedded platforms that benefit from reconfiguration and custom datapaths.

Unique Advantages

• Highly integrated resource set: 80,000 logic elements combined with ~6.84 Mbits of embedded memory and 744 I/Os reduce external components and simplify board-level design.
• Flexible power/performance trade-offs: Selectable core voltage (0.860–1.15 V) and Stratix III programmable power technology enable tuning between lower power and higher performance modes.
• Built-in security and reliability: Family-level support for 256-bit AES configuration security and CRC/ECC protection helps safeguard IP and improves runtime robustness.
• Rich clocking and timing control: Extensive clocking resources and up to 12 PLLs provide the timing flexibility required for multi‑domain and high‑speed designs.
• Proven IP and ecosystem: Support for Nios II and Altera MegaCore functions accelerates development with tested building blocks and software infrastructure.
• Commercial package and assembly: 1152‑FBGA surface-mount package in a compact 35 × 35 mm footprint supports dense board layouts for space-constrained systems.

Why Choose EP3SE80F1152C3G?

The EP3SE80F1152C3G positions itself as a capable, commercially graded Stratix III FPGA for customers requiring a balance of logic density, on-chip memory and high I/O count in a single-package solution. Its selectable core voltage and family-level power optimizations allow designers to tune devices for their target performance and power envelopes.

This device is well suited to teams building DSP-heavy, networking or embedded-accelerator systems that need reconfigurability, integrated security and robust clocking. Combined with available Stratix III IP and processor support, it provides a scalable platform for medium-to-high complexity designs with long-term maintainability.

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