EP3SE80F1152C4G

The EP3SE80F1152C4G is a commercial-grade Stratix III family FPGA from Intel, providing a high-density programmable logic platform for performance-focused embedded and digital signal processing designs. It combines 80,000 logic elements, several megabits of on-chip RAM, and a wide set of system features to address applications that require complex logic, memory interfacing, and high-speed I/O.

Designed for surface-mount board integration, this device targets communications, networking, DSP, and high-performance embedded systems where flexibility, integration, and predictable supply-chain compliance are required.

Key Features

• Logic Capacity — 80,000 logic elements for implementing complex state machines, custom processors, and large combinational/sequential logic networks.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support large buffers, FIFOs, and embedded data structures.
• I/O Density — 744 user I/O pins to support wide parallel interfaces and multiple memory or peripheral connections.
• Clocking Resources — Family-level support for extensive clocking: up to 16 global clocks, regional and peripheral clocks, and up to 12 PLLs for flexible clock synthesis and distribution.
• High-Speed Interfaces — Family features include high-speed differential I/O with SERDES and dynamic phase alignment capabilities for multi-gigabit signaling and protocol support.
• Security & Reliability — Series-level features include optional 256-bit AES configuration security, cyclical redundancy check (CRC) for configuration memory, and ECC for embedded memory blocks to support robust system operation.
• Power & Core Voltage — Core supply range of 0.86 V to 1.15 V; device leverages power-optimization capabilities found in the Stratix III family to balance performance and power consumption.
• Package & Mounting — 1152-ball FBGA package (35×35 mm) in a surface-mount form factor for compact, board-level integration.
• Environmental & Grade — Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-Performance DSP — Implement FIR filters, multiply-accumulate chains, and other signal-processing pipelines using the device’s logic and embedded memory.
• Networking & Communications — Use high-speed differential I/O and SERDES capabilities for protocol bridging, packet processing, and interface aggregation.
• Memory Interface Controllers — Support for complex external memory interfaces and abundant I/O makes the device suitable for controllers and memory-buffering applications.
• Embedded Systems & Custom Logic — Leverage large logic capacity and on-chip RAM for custom processors, accelerators, and glue-logic in embedded platforms.

Unique Advantages

• High Logic Density: 80,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity and BOM count.
• Substantial On-Chip Memory: Approximately 6.84 Mbits of embedded RAM provide local storage for buffering and data manipulation without external memory overhead.
• Extensive I/O: 744 I/O pins accommodate wide parallel buses, multiple peripheral connections, and large memory interfaces.
• Robust Clocking and PLL Resources: Multiple PLLs and rich clocking resources simplify high-performance timing architectures and multi-clock-domain designs.
• Package Integration: 1152-ball FBGA (35×35) offers a compact, board-friendly package for high-density designs.
• Compliance and Assembly Ready: Surface-mount package and RoHS compliance facilitate modern manufacturing and environmental requirements.

Why Choose EP3SE80F1152C4G?

The EP3SE80F1152C4G delivers a balanced combination of high logic capacity, several megabits of embedded memory, and a large complement of I/O in a compact 1152-FBGA package. It is suited for customers building complex DSP, networking, and embedded designs that need on-chip resources to reduce external components and simplify system architecture.

Backed by Stratix III family features for clocking, security, and reliability, this device offers a scalable platform for engineers who require deterministic electrical characteristics, commercial-temperature operation, and RoHS compliance.

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