EP3SE80F1152C3

The EP3SE80F1152C3 is a Stratix® III E Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. It delivers a large logic fabric, substantial on‑chip memory, and a high I/O count for designs that require dense digital integration.

With 80,000 logic elements, approximately 6.84 Mbits of embedded RAM and 744 available I/O, this device targets complex, high‑pin‑count applications where consolidation of logic and memory into a single device reduces board complexity and component count.

Key Features

• Core Logic Stratix® III E FPGA architecture with 80,000 logic elements to implement large combinational and sequential logic designs.
• Embedded Memory Approximately 6.84 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive logic functions.
• I/O and Package 744 I/O pins delivered in a 1152‑BBGA, FCBGA package; supplier device package listed as 1152‑FBGA (35×35).
• Power Core voltage support from 860 mV to 1.15 V to match system power rails and enable targeted power delivery designs.
• Operating Conditions Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Mounting and Compliance Surface mount package with RoHS compliance for regulatory and assembly considerations.

Typical Applications

• High‑density digital systems — Consolidate complex logic functions and state machines into a single FPGA to reduce BOM and PCB area.
• Data buffering and packet processing — Use the device’s embedded RAM for packet queues, FIFOs, and temporary data storage in high‑channel designs.
• Multi‑I/O interface hubs — Leverage 744 I/O pins to aggregate and bridge numerous external interfaces or parallel channels.
• Custom compute and control — Implement application‑specific accelerators and control logic that benefit from abundant logic elements and on‑chip memory.

Unique Advantages

• High logic capacity: 80,000 logic elements enable implementation of large, integrated digital systems without partitioning across multiple devices.
• Meaningful on‑chip memory: Approximately 6.84 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Extensive I/O resources: 744 I/O pins support dense connectivity and simplify routing for multi‑channel or multi‑interface designs.
• Compact, manufacturable package: 1152‑BBGA (35×35) FCBGA in a surface mount form factor supports high‑density PCB assembly workflows.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP3SE80F1152C3?

The EP3SE80F1152C3 positions itself as a commercially graded, high‑capacity Stratix® III E FPGA for designs that require significant logic resources, embedded memory, and substantial I/O in a single package. Its combination of 80,000 logic elements, approximately 6.84 Mbits of RAM, and 744 I/O pins makes it well suited for engineers consolidating complex digital functions to save board space and reduce component count.

Designed for commercial applications operating from 0 °C to 85 °C and operating at a core voltage range of 860 mV to 1.15 V, this device offers a balanced platform for scalable, robust designs where integration and connectivity are priorities.

Request a quote or contact sales to discuss availability, pricing, and lead times for EP3SE80F1152C3.