EP3SE80F1152C2N

The EP3SE80F1152C2N is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, designed for applications that require substantial logic capacity and extensive I/O connectivity. The device provides 80,000 logic elements, approximately 6.84 Mbits of embedded memory, and 744 I/O pins in a surface-mount 1152‑FBGA package.

Supplied as a commercial-grade, RoHS-compliant FPGA, it operates over a 0 °C to 85 °C range and supports a core supply window of 860 mV to 1.15 V, making it suitable for a wide range of standard industrial and electronics designs that need large-scale programmable logic and memory integration.

Key Features

• Logic Capacity — 80,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support data buffering, packet storage, and other memory-intensive functions.
• I/O Density — 744 I/O pins to accommodate extensive peripheral interfacing, high-pin-count buses, and multi-channel connectivity.
• Power — Core voltage supply range from 860 mV to 1.15 V to match system power-rail requirements.
• Package & Mounting — Surface-mount 1152‑BBGA / FCBGA format; supplier device package listed as 1152‑FBGA (35×35) for compact, high-density board integration.
• Operating Range — Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Deploy the FPGA where large logic counts and embedded memory are required to implement complex processing and control functions.
• Interface aggregation — Use the 744 I/Os for routing multiple high-pin-count interfaces, bridging, or custom I/O expansion on a single device.
• Data buffering and packet handling — Leverage approximately 6.84 Mbits of on-chip RAM for buffering, temporary storage, and streaming data paths.
• Compact board designs — The 1152‑FBGA (35×35) surface-mount package supports dense PCB layouts where board space is at a premium.

Unique Advantages

• Significant logic resources: 80,000 logic elements enable integration of complex custom logic without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks, simplifying system design.
• High I/O count: 744 I/Os give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Space-efficient packaging: The 1152‑FBGA (35×35) package provides a compact footprint for high-density board layouts.
• Commercial temperature support: Rated 0 °C to 85 °C for use in typical commercial electronic environments.
• RoHS compliant: Meets environmental compliance requirements for lead-free designs.

Why Choose EP3SE80F1152C2N?

The EP3SE80F1152C2N combines large-scale programmable logic with significant embedded memory and a high I/O count in a compact FBGA package, delivering a balanced platform for designers implementing complex digital systems. Its commercial-grade operating range and RoHS compliance make it suitable for mainstream electronics products that require durable, high-density programmable logic.

This FPGA is well suited to engineering teams and procurement looking for a single-device solution that reduces board-level complexity by integrating logic, memory, and abundant I/O, while maintaining predictable supply-voltage and thermal characteristics backed by Intel's Stratix® III E family platform.

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