EP3SE80F1152C2

The EP3SE80F1152C2 is an Intel Stratix® III E field programmable gate array (FPGA) supplied in a 1152-BBGA (FCBGA) package. It integrates a high logic capacity with substantial on-chip memory and a large I/O count to support complex digital designs.

With 80,000 logic elements, approximately 6.84 Mbits of embedded memory, and 744 I/Os, this commercial-grade, surface-mount device targets applications that require high-density logic, significant embedded RAM, and extensive connectivity within a compact package.

Key Features

• Logic Capacity 80,000 logic elements provide substantial programmable logic resources for implementing large-scale digital functions and custom processing pipelines.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM (6,843,392 bits) to support buffering, FIFOs, and local data storage without external memory in many use cases.
• High I/O Count 744 I/O pins enable wide parallel interfaces and multi-channel connectivity for high-pin-count system designs.
• Power Supply Range Core voltage support from 860 mV to 1.15 V to match system power architectures and optimize core power consumption.
• Package and Mounting 1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA (35×35), designed for surface-mount PCB assembly.
• Operating Conditions and Grade Commercial-grade device rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• Regulatory Compliance RoHS compliant, aligning with common environmental and material requirements.

Typical Applications

• High-density digital processing — Implements complex logic functions and custom algorithms using 80,000 logic elements for compute-intensive tasks.
• Memory-intensive designs — Leverages approximately 6.84 Mbits of embedded RAM for buffering, packet storage, and local data handling without immediate external memory.
• Multi-channel I/O systems — Uses 744 I/Os to interface with multiple peripherals, sensors, or parallel data paths in high-pin-count systems.
• Compact system integration — 1152-BBGA package and surface-mount mounting suit space-constrained PCBs requiring high integration density.

Unique Advantages

• High programmable logic density: 80,000 logic elements enable extensive on-chip implementation of custom logic, reducing dependency on external ASICs or discrete logic.
• Significant on-chip RAM: Approximately 6.84 Mbits of embedded memory supports data buffering and intermediate storage, simplifying memory architecture.
• Extensive I/O capability: 744 I/O pins provide the pin count needed for multi-channel interfaces, wide buses, and complex board-level connectivity.
• Compact, high-pin-count package: The 1152-BBGA (35×35) FCBGA package delivers high interconnect density in a surface-mount form factor suitable for compact system designs.
• Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial manufacturing and material requirements.
• Flexible power operation: Core voltage range of 860 mV to 1.15 V accommodates various power supply designs and optimization strategies.

Why Choose EP3SE80F1152C2?

The EP3SE80F1152C2 combines high logic capacity, substantial embedded memory, and a large I/O count in a compact 1152-BBGA surface-mount package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of standard electronics projects that require dense, integrated FPGA resources.

This device is well suited for designers who need a balance of logic density, on-chip RAM, and extensive connectivity while maintaining a compact board footprint and standard commercial operating conditions. Its specifications make it a practical choice for scaling complex digital designs and integrating multiple interfaces on a single FPGA.

Request a quote or submit a pricing inquiry to obtain availability and lead-time details for the EP3SE80F1152C2. Our team can provide a formal quote to support your procurement and design timelines.