EP3SE50F780I4N

The EP3SE50F780I4N is an Intel Stratix® III E field-programmable gate array (FPGA) in a 780‑BBGA FCBGA package designed for industrial applications. It delivers high logic density, substantial on-chip memory, and broad I/O capacity for complex digital designs and embedded systems operating across a wide temperature range.

Key Features

• Core Logic  47,500 logic elements for implementing complex custom logic, state machines, and data-paths.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate storage without external memory.
• I/O Capacity  488 I/O pins to interface with sensors, transceivers, peripherals, and external memory or logic devices.
• Power Supply  Core voltage range of 0.86 V to 1.15 V for flexible power-rail integration.
• Package & Mounting  780‑BBGA (FCBGA), supplier package 780‑FBGA (29×29), surface-mount device suited to compact board layouts.
• Operating Range  Industrial temperature rating from -40 °C to 100 °C for deployment in demanding environmental conditions.
• RoHS Compliance  Manufactured to RoHS-compliant standards.

Typical Applications

• Industrial Control Systems  Use the device for motor control, PLC adjuncts, and real-time logic where industrial temperature ratings and high logic density matter.
• Signal Processing  Implement filtering, packet handling, and custom data-paths using abundant logic elements and on-chip RAM for intermediate buffering.
• Communications Equipment  Integrate protocol handling, packet framing, and interface bridging leveraging the large I/O count and embedded memory.
• Custom Embedded Platforms  Build application-specific accelerators and control logic for compact boards using the FCBGA package and surface-mount mounting.

Unique Advantages

• High logic density: 47,500 logic elements permit consolidation of multiple functions into a single device, reducing board-level complexity.
• Ample embedded memory: Approximately 5.76 Mbits of on-chip RAM supports packet buffering, state storage, and temporary data staging without external RAM.
• Extensive I/O: 488 I/Os enable integration of numerous interfaces and peripherals directly to the FPGA.
• Industrial temperature capability: Rated from -40 °C to 100 °C for reliable operation in harsh environments.
• Compact, board-friendly package: 780‑BBGA (29×29) surface-mount package suitable for space-constrained designs.
• Flexible core voltage: 0.86–1.15 V supply range aids integration with a variety of power architectures.

Why Choose EP3SE50F780I4N?

The EP3SE50F780I4N combines substantial logic resources, significant on-chip memory, and broad I/O in a compact FCBGA package targeted at industrial-grade embedded designs. Backed by Intel's Stratix® III E family, it is well suited for designers who need a single-device solution for complex control, signal processing, and communications tasks across demanding temperature environments.

For projects that require a balance of density, memory, and I/O in an industrial-rated FPGA, the EP3SE50F780I4N provides a clear, verifiable specification set to evaluate during system architecture and procurement.

Request a quote or submit an availability inquiry for the EP3SE50F780I4N today to get pricing and lead-time information.