EP3SE50F780I4G

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 488 5760000 47500 780-BBGA, FCBGA

Quantity 1,670 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits5760000

Overview of EP3SE50F780I4G – Stratix® III E FPGA, 47,500 logic elements, ~5.76 Mbits RAM, 488 I/Os, 780-FBGA

The EP3SE50F780I4G is a Stratix® III E family field programmable gate array (FPGA) optimized for memory- and multiplier-rich, data-centric designs. This industrial-grade device integrates approximately 5.76 Mbits of embedded RAM, 47,500 logic elements, and 488 user I/Os in a 780-FBGA (29×29) package to support high-density, high-performance logic, DSP and embedded applications.

Designed for systems requiring flexible power/performance trade-offs, the device supports selectable core voltage and Programmable Power Technology to manage power where needed. It is specified for a supply range of 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Resources 47,500 logic elements for implementing complex control, signal processing, and custom logic functions.
  • Embedded Memory Approximately 5.76 Mbits of on-chip RAM to support large buffers, FIFOs, and data path storage.
  • High I/O Density 488 user I/Os arranged for versatile interfacing and system integration without excessive external multiplexing.
  • DSP and Multiplier Support Stratix III E family is memory- and multiplier-rich, providing dedicated DSP capabilities for data-centric processing tasks.
  • Power and Voltage Programmable Power Technology and selectable core voltage enable designers to balance performance and power consumption; device core supply range is 860 mV to 1.15 V.
  • Security and Reliability Family-level support for 256-bit AES encryption (volatile and non-volatile) and configuration memory CRC/ECC features for detection and correction of configuration and memory errors.
  • Package and Mounting Surface-mount 780-FBGA (29×29) package for high-density board designs.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C for robust industrial deployments.
  • Ecosystem Support Family support for embedded processors and megafunction IP (for example Nios® II and MegaCore® functions) to accelerate system development.

Typical Applications

  • High-performance DSP and Signal Processing Use the device’s dense logic, embedded RAM, and multiplier-rich architecture for FIR filters, FFTs, and real-time signal pipelines.
  • Network and Communications Implement packet processing, protocol bridging, and interface logic that benefit from abundant I/Os and on-chip memory.
  • Memory Interface Controllers Build controllers and buffering for external DRAM and high-speed memory subsystems, leveraging on-chip memory and timing resources.
  • Embedded Systems and Control Integrate processors, control logic, and peripheral interfacing within a single FPGA for industrial automation and embedded applications.

Unique Advantages

  • High compute and memory density: 47,500 logic elements combined with ~5.76 Mbits of embedded RAM reduces the need for external components and shortens design cycles.
  • Flexible power management: Selectable core voltage and Programmable Power Technology let designers trade performance for lower power where appropriate.
  • Industrial readiness: −40 °C to 100 °C operating range and surface-mount FBGA packaging support demanding field and industrial environments.
  • Robust security and reliability options: Family-level AES encryption and configuration memory CRC/ECC capabilities help protect designs and detect/correct configuration errors.
  • Extensive I/O capacity: 488 user I/Os provide broad interfacing options for peripherals, memory, and high-speed links without complex external circuitry.
  • Design ecosystem support: Compatibility with embedded processor IP and megafunction libraries accelerates development and integration.

Why Choose EP3SE50F780I4G?

The EP3SE50F780I4G positions itself as a high-density, memory- and multiplier-rich FPGA for applications that demand significant on-chip RAM, DSP resources, and a large I/O count in an industrial-grade package. Its selectable core voltage and built-in power-management features provide designers control over performance versus power consumption, while family-level security and error-detection features add robustness for long-lived systems.

This device is well suited to teams building data-centric processing, networking, memory interface, and embedded control solutions that benefit from a mature FPGA ecosystem and integrated IP support.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SE50F780I4G and to discuss how it can fit your next design.

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