EP3SE50F780I4

The EP3SE50F780I4 is a Stratix® III E field programmable gate array (FPGA) optimized for high-density logic integration. It delivers approximately 47,500 logic elements and approximately 5.76 Mbits of embedded memory in a 780-ball FCBGA package.

With 488 user I/Os, an industrial operating temperature range (-40 °C to 100 °C), and a core supply range of 860 mV to 1.15 V, this device is suited for designs that require substantial logic capacity, on-chip memory and broad I/O connectivity in surface-mount form factors.

Key Features

• Configurable Logic  Approximately 47,500 logic elements for implementing complex digital functions and custom logic fabrics.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM for buffering, LUTs and state storage.
• High I/O Density  488 user I/Os to support extensive external interfacing without extensive external glue logic.
• Flexible Core Supply  Core voltage range of 860 mV to 1.15 V to accommodate different power-domain requirements.
• Package & Mounting  780-BBGA / FCBGA surface-mount package with 780-FBGA (29×29) supplier footprint for compact PCB integration.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Use the FPGA’s industrial temperature rating and logic density for control algorithms, sequencing and protocol adaptation in factory and process equipment.
• High-density I/O Systems  Leverage 488 I/Os to aggregate sensors, actuators and external peripherals with minimal additional interface components.
• Embedded Processing and Prototyping  Implement custom data paths, state machines and on-chip memory structures for evaluation and proof-of-concept systems.
• Ruggedized Electronics  Deploy designs that require extended temperature operation and surface-mount integration in harsh or remote environments.

Unique Advantages

• High Logic Capacity: Approximately 47,500 logic elements enable large-scale custom logic implementations without immediately moving to multi-chip solutions.
• Significant On-chip Memory: Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• Extensive I/O Count: 488 I/Os provide broad external connectivity, simplifying board-level design and reducing the need for additional I/O expanders.
• Industrial-rated Temperature Range: -40 °C to 100 °C operation supports deployment in demanding environments where temperature tolerance matters.
• Flexible Power Interface: Core supply range of 860 mV to 1.15 V allows alignment with varying power architectures and domain requirements.
• Compact, High-density Package: 780-FBGA (29×29) surface-mount footprint delivers many I/Os and high integration in a single compact package.

Why Choose EP3SE50F780I4?

The EP3SE50F780I4 combines substantial logic resources and embedded memory with a high I/O count and industrial temperature rating, making it a practical choice for designers who need a single-chip, high-density FPGA solution. Its surface-mount 780-FBGA footprint and RoHS compliance support modern PCB assembly and environmental requirements.

This device is suitable for engineering teams developing industrial controls, I/O-rich systems and embedded prototypes that require on-chip memory and robust operating range. Its specification set provides scalability and integration potential that can simplify BOMs and shorten development cycles.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SE50F780I4 and to discuss how it fits your design requirements.