EP3SE50F780I3N

The EP3SE50F780I3N is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel, offering a high count of programmable logic and embedded memory in a compact FCBGA package. Designed for industrial applications, it delivers a combination of large on‑chip RAM, extensive I/O capacity, and a wide operating temperature range for robust, customizable digital designs.

Key Features

• Core Logic  Provides 47,500 logic elements to implement complex custom digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 5.76 Mbits of on‑chip RAM to support data buffering, packet storage, and state machines without external memory.
• I/O Capacity & Package  488 device I/O pins in a 780‑ball BGA (780‑FBGA, 29×29) surface‑mount package, supporting dense system integration and extensive peripheral connectivity.
• Power  Nominal core voltage operating range from 860 mV to 1.15 V to match modern low‑voltage power rails.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance  RoHS compliant to meet current environmental and manufacturing regulations.

Typical Applications

• Industrial Automation  Implement control logic, sensor aggregation, and motor or actuator interfaces using abundant logic elements and 488 I/O pins for diverse field connections.
• Custom Digital Processing  Create tailored data processing pipelines and protocol handlers that leverage the FPGA’s 47,500 logic elements and embedded RAM for intermediate storage and buffering.
• High‑Density I/O Systems  Deploy in systems that require many external interfaces—488 I/O pins and the 780‑FBGA package provide a compact footprint with broad connectivity.

Unique Advantages

• High Logic Capacity: 47,500 logic elements enable implementation of complex, highly parallel designs without excessive partitioning.
• Substantial On‑Chip Memory: Approximately 5.76 Mbits of embedded RAM reduce reliance on external memory and simplify board-level design.
• Extensive I/O: 488 I/O pins support multiple interfaces and sensor arrays, minimizing the need for external multiplexing.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to support deployment in harsh or temperature‑variable environments.
• Compact, Surface‑Mount BGA: 780‑FBGA (29×29) package enables dense, reliable PCB integration for space‑constrained systems.
• RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose EP3SE50F780I3N?

The EP3SE50F780I3N delivers a balanced mix of programmable logic density, embedded memory, and I/O capacity in a robust industrial‑grade package. It is well suited for engineers and OEMs who need a configurable silicon platform that supports complex control, interfacing, and data‑handling tasks while maintaining thermal and environmental resilience.

Backed by Intel’s Stratix® III E architecture and supplied in a 780‑ball FCBGA surface‑mount package, this device offers a scalable foundation for mid‑to‑high complexity designs where integration, performance, and operational stability are priorities.

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