EP3SE50F780I3

The EP3SE50F780I3 is a Stratix® III E field programmable gate array (FPGA) IC from Intel, packaged in a 780-ball FCBGA (29 × 29 mm) package for surface-mount applications. It provides a large logic capacity, substantial on-chip RAM, and a high I/O count targeted at industrial designs that require programmable logic, flexible interfacing, and extended operating temperature support.

Key Features

• Logic Capacity — 47,500 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for buffering, packet memory, and state storage.
• I/O Resources — 488 general-purpose I/Os to support dense connectivity and multiple parallel interfaces.
• Package and Mounting — 780-BBGA / FCBGA package (supplier device package: 780-FBGA, 29×29 mm) optimized for surface-mount PCB assembly.
• Power Supply — Core voltage range from 860 mV to 1.15 V for compatibility with common FPGA power architectures.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
• RoHS Compliant — Constructed to meet RoHS environmental requirements.

Typical Applications

• Industrial control and automation — Use the FPGA's logic capacity and I/O density to implement control algorithms, real-time interfacing, and protocol bridging in industrial systems operating across extended temperatures.
• Communications and networking equipment — Apply on-chip RAM and abundant I/Os for packet buffering, custom switching, and interface aggregation in network modules.
• Test and measurement — Leverage programmable logic and large memory resources for signal processing, data capture, and custom instrument control functions.

Unique Advantages

• High integration of logic and memory — 47,500 logic elements combined with approximately 5.76 Mbits of embedded RAM reduce external component count and simplify board design.
• Large I/O capacity — 488 I/Os enable high-density interfacing with sensors, peripherals, and parallel buses without additional I/O expanders.
• Industrial-ready operating range — Specified for −40 °C to 100 °C operation to support robust performance in demanding environments.
• Compact FCBGA packaging — 780-ball FCBGA (29 × 29 mm) provides a compact footprint for high-density PCB layouts while supporting surface-mount assembly.
• Controlled core voltage — 860 mV to 1.15 V supply compatibility aligns with common FPGA power delivery solutions for predictable thermal and power budgeting.

Why Choose EP3SE50F780I3?

The EP3SE50F780I3 positions itself as a high-capacity, industrial-grade Stratix® III E FPGA suited for applications that demand substantial programmable logic, significant on-chip memory, and a large number of I/Os. Its FCBGA packaging and surface-mount form factor make it appropriate for compact, high-density board designs where robustness across −40 °C to 100 °C is required.

Designed and supplied by Intel, the device offers a balanced combination of logic resources, embedded RAM, and I/O count for developers and procurement teams focused on scalable, reliable FPGA-based solutions in industrial and communication-focused systems.

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