EP3SE50F780C4L

The EP3SE50F780C4L is a Stratix® III E FPGA in a 780-ball FCBGA package, offered for commercial-grade programmable logic applications. It delivers a combination of on-chip logic, embedded memory, and extensive I/O to support complex digital designs that require reconfigurable hardware capacity.

Key Features

• Logic Capacity — 47,500 logic elements with 1,900 logic blocks provide substantial programmable fabric for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing close to the logic.
• I/O Resources — 488 user I/O pins to support a wide range of parallel and serial interfacing requirements in board-level designs.
• Package & Mounting — 780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount assembly on modern PCBs.
• Power — Core supply voltage range of 0.86 V to 1.15 V, enabling integration with modern power-rail architectures.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C suitable for standard commercial environments.
• Regulatory Compliance — RoHS compliant, meeting common environmental directives for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Implement custom logic, data-paths, and control functions in commercial embedded products that operate within 0 °C to 85 °C and require substantial I/O.
• High-density Logic Integration — Integrate complex state machines, protocol engines, and hardware accelerators using 47,500 logic elements and approximately 5.76 Mbits of embedded memory.
• Board-level Prototyping and Development — Use the 780-ball FCBGA package and 488 I/O pins for prototyping multi-interface designs and validating system-level hardware architectures.

Unique Advantages

• High Logic Density: 47,500 logic elements enable consolidation of multiple functions into a single device, reducing component count.
• Significant On-chip Memory: Approximately 5.76 Mbits of embedded RAM provide locally accessible storage to improve throughput and lower external memory dependency.
• Extensive I/O Count: 488 I/O pins allow flexible interfacing to peripherals, sensors, and other system components without additional interface chips.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, aligning with typical commercial product requirements.
• RoHS Compliant: Supports lead-free board assembly and compliance with common environmental standards.

Why Choose EP3SE50F780C4L?

The EP3SE50F780C4L balances substantial programmable logic capacity, sizable embedded memory, and broad I/O in a compact 780-BBGA FCBGA package for commercial applications. It is suitable for designers who need a reconfigurable, high-density solution from a recognized manufacturer for consolidating custom digital functions and accelerating system development.

This device is aimed at teams building commercial embedded systems, prototypes, or multi-interface boards that require a combination of logic resources, on-chip RAM, and high I/O counts while maintaining RoHS compliance.

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