EP3SE50F780C4

The EP3SE50F780C4 is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, delivered in a 780-FBGA (29×29) surface-mount package. It provides a high logic density of 47,500 logic elements and approximately 5.76 Mbits of embedded memory, along with 488 user I/O pins, making it suitable for designs that require substantial on-chip logic and memory in a compact BGA package.

Key electrical and environmental characteristics include a core voltage range of 860 mV to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core Architecture  Stratix® III E FPGA family device providing programmable logic resources with 47,500 logic elements for mid-to-high density designs.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many functions.
• I/O Capacity  488 external I/O pins to support a wide range of parallel interfaces and multi-channel connectivity on a single device.
• Power Supply  Core operating voltage range from 860 mV to 1.15 V to match system power domains and regulator choices.
• Package and Mounting  780-BBGA (FCBGA) surface-mount package — supplier device package listed as 780-FBGA (29×29) — for compact board-level integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and designated as commercial grade.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic density: 47,500 logic elements provide substantial on-chip programmable resources for complex logic and control functions.
• Significant embedded memory: Approximately 5.76 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O: 488 I/O pins enable flexible interfacing with peripherals, sensors, and external busses on a single device.
• Compact BGA footprint: 780-FBGA (29×29) package supports compact PCB layouts while maintaining high pin count.
• Controlled power envelope: Core voltage range of 860 mV–1.15 V allows for integration with modern power management schemes.
• Compliance and commercial readiness: RoHS compliance and commercial temperature rating simplify qualification for consumer and commercial products.

Why Choose EP3SE50F780C4?

The EP3SE50F780C4 balances high logic capacity, sizeable embedded memory, and broad I/O in a single Stratix® III E FPGA package, making it a practical choice for designers needing concentrated programmable resources without a large board footprint. Its 780-FBGA (29×29) package and 488 I/Os support dense, multi-interface implementations while the documented voltage and temperature ranges provide clear integration parameters for commercial applications.

As a part of the Intel Stratix® III E family, this device suits customers targeting designs that require robust on-chip logic and memory capacity, compact packaging, and standard commercial operating conditions. The part’s specifications support scalable design decisions and straightforward evaluation against system-level power and thermal constraints.

Request a quote or submit an availability inquiry to receive pricing and lead-time information for EP3SE50F780C4.