EP3SE50F780C3G

The EP3SE50F780C3G is a Stratix III E series Field Programmable Gate Array (FPGA) implemented in a 780‑ball FCBGA (29×29) package for surface-mount applications. This commercial‑grade device combines a high logic capacity—47,500 logic elements—with approximately 5.76 Mbits of embedded RAM and 488 user I/Os to address data‑centric designs that require substantial on‑chip memory and I/O density.

Built on the Stratix III E architecture, the device inherits series capabilities for memory‑rich and multiplier‑rich applications, selectable core voltage operation, and programmable power techniques described in the device family handbook.

Key Features

• Logic Capacity — 47,500 logic elements suitable for complex logic, control and data‑path implementations.
• On‑Chip Memory — Approximately 5.76 Mbits of embedded RAM for FIFOs, buffers and local data storage within the FPGA fabric.
• I/O Density — 488 user I/Os in a modular I/O arrangement, enabling broad interfacing options for parallel buses, memory interfaces and peripheral connectivity.
• Power and Voltage — Operates with a core supply range of 860 mV to 1.15 V and includes Stratix III family programmable power and selectable core voltage capabilities.
• Clocking and PLLs — Series supports flexible clocking including multiple global, regional and peripheral clocks and up to 12 PLLs for clock synthesis and management.
• DSP and Multipliers — Stratix III family includes high‑speed DSP blocks and dedicated multipliers for efficient implementation of signal processing functions.
• Security and Reliability — Series features include optional 256‑bit AES encryption for configuration bitstream protection and built‑in CRC/ECC mechanisms for configuration and memory integrity.
• Package and Mounting — 780‑BBGA / FCBGA (supplier package 780‑FBGA 29×29) in a surface‑mount form factor; commercial grade with operating range 0 °C to 85 °C.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• High‑performance networking — Implement packet processing, interface bridging and protocol offload with the device's high logic count, abundant on‑chip memory and modular I/O.
• Memory‑centric systems — Use embedded RAM and I/O density to build memory controllers, buffering and data staging for DDR/DDR2/DDR3 interfaces supported by the Stratix III family architecture.
• Digital signal processing — Leverage on‑chip DSP resources and dedicated multipliers to accelerate FIR filters, transforms and other compute‑intensive signal processing tasks.
• Prototyping and system integration — Suitable for prototyping complex ASIC‑like functions and consolidating multiple discrete components into a single FPGA‑based subsystem.

Unique Advantages

• High integration density: 47,500 logic elements with ~5.76 Mbits of embedded memory reduce external component count and simplify board-level design.
• Flexible I/O architecture: 488 user I/Os in a modular bank structure enable diverse interface implementations and vertical migration within the Stratix III family.
• Power optimization: Selectable core voltage and family programmable power techniques allow designers to balance performance and power consumption.
• On‑device security and reliability: Series support for AES encryption and CRC/ECC improves protection of intellectual property and robustness of configuration and memory data.
• Surface‑mount, compact package: 780‑ball FCBGA (29×29) provides a high‑density solution for space‑constrained PCBs while maintaining broad I/O capability.

Why Choose EP3SE50F780C3G?

The EP3SE50F780C3G positions itself for designers who need a memory‑rich, high‑logic FPGA with substantial I/O for data‑centric and signal processing applications. Its combination of 47,500 logic elements, approximately 5.76 Mbits of embedded RAM and 488 I/Os in a 780‑FBGA package provides a balanced platform for consolidating system functions, accelerating algorithms and implementing complex interfaces.

Selecting this Stratix III E device offers long‑term design flexibility through family‑level features such as selectable core voltage, robust clocking and PLL resources, security options and on‑chip reliability mechanisms, backed by the device family handbook and development ecosystem.

Request a quote or submit an inquiry to get pricing and availability for EP3SE50F780C3G and to discuss how this FPGA can fit your next design.