EP3SE50F780C2

The EP3SE50F780C2 is a Stratix® III E field-programmable gate array (FPGA) provided in a 780-ball FCBGA package. It delivers a high logic element count and substantial on-chip memory, combined with a large I/O complement and a compact surface-mount FBGA footprint.

Designed for commercial-temperature applications, this device targets designs that require significant programmable logic capacity, embedded RAM, and flexible I/O while operating from a low-voltage core supply.

Key Features

• Core Logic — 47,500 logic elements (cells) to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Capacity — 488 user I/O pins suitable for multi-channel interfacing and wide bus architectures.
• Power Supply Range — Core voltage range from 860 mV to 1.15 V, enabling compatibility with low-voltage system designs.
• Package and Mounting — 780-ball FBGA (29×29) surface-mount package in a 780-BBGA, FCBGA case for high-density board integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High-density logic designs — Use where up to 47,500 logic elements and approximately 5.76 Mbits of embedded memory are required for custom digital processing.
• Multi-channel I/O systems — Suitable for boards requiring a large number of external interfaces thanks to 488 user I/Os.
• Compact system integration — The 780-FBGA (29×29) surface-mount package supports space-constrained PCBs that need high gate density in a small footprint.

Unique Advantages

• High logic capacity: 47,500 logic elements provide the headroom needed for complex custom logic implementations without external ASICs.
• Substantial on-chip RAM: Approximately 5.76 Mbits of embedded memory reduces reliance on external memory for buffering and local data storage.
• Extensive I/O availability: 488 I/Os simplify board-level routing for multi-channel and wide-parallel interfaces.
• Low-voltage core operation: Core supply range of 0.86–1.15 V supports integration into low-power system architectures.
• High-density packaging: 780-ball FBGA (29×29) provides a compact, surface-mount solution for high-pin-count requirements.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for typical commercial-environment deployments.

Why Choose EP3SE50F780C2?

The EP3SE50F780C2 positions itself as a high-capacity Stratix® III E FPGA option for commercial designs that require a balance of logic density, embedded memory, and extensive I/O in a compact FBGA package. Its combination of 47,500 logic elements, approximately 5.76 Mbits of on-chip RAM, and 488 I/Os supports complex, board-level system integration without excessive external components.

This device is well suited to engineers and procurement teams building commercial-temperature electronic systems that need scalable programmable logic, compact packaging, and RoHS compliance. Its low-voltage core range and surface-mount 780-FBGA package make it a practical choice for dense, low-profile PCB implementations.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP3SE50F780C2.