EP3SE50F484I4N

The EP3SE50F484I4N is an Intel Stratix® III E field programmable gate array (FPGA) supplied in a 484-ball FCBGA package. It integrates 47,500 logic elements and approximately 5.76 Mbits of embedded on-chip RAM to implement custom digital logic and memory-intensive functions.

Designed for surface-mount assembly and specified to industrial-grade temperature limits, this device provides a combination of logic density, embedded memory, and a high I/O count suitable for complex system designs that require an industrial operating range and robust packaging.

Key Features

• Core Logic 47,500 logic elements provide the programmable resources for custom digital logic, state machines and datapath implementations.
• Embedded Memory Approximately 5.76 Mbits of on-chip RAM for buffering, frame storage, and fast local data access without external memory.
• I/O Capacity 296 user I/O pins to support multiple interfaces, parallel buses and signal routing across system domains.
• Power Supply Range Operates from 0.860 V to 1.15 V core supply, enabling designs that target the specified FPGA core voltage envelope.
• Package & Mounting 484-ball FCBGA (484-FBGA, 23×23) surface-mount package for compact board integration and controlled routability.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal requirements for industrial environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the industrial temperature rating and extensive I/O to implement control logic, sensor interfacing and real-time processing in factory and process environments.
• Data Buffering and Protocol Bridging — Leverage the on-chip RAM and abundant logic elements to implement buffering, packet processing and protocol conversion without immediate dependence on external memory.
• Custom Logic and Acceleration — Implement application-specific datapaths, finite-state machines and hardware acceleration blocks using the available logic resource pool and I/O channels.

Unique Advantages

• Substantial logic capacity: 47,500 logic elements enable large, complex designs or multiple concurrent functions in a single device.
• Integrated embedded memory: Approximately 5.76 Mbits of on-chip RAM reduces the need for external memory for many buffering and storage tasks.
• High I/O count: 296 user I/Os give flexibility for multi-channel interfaces and dense system integration.
• Industrial temperature rating: −40 °C to 100 °C supports deployment in demanding temperature environments.
• Compact FCBGA package: 484-ball FCBGA (23×23) enables a balance of board density and signal routing for complex PCBs.
• RoHS compliant: Meets common environmental material requirements for modern electronics assemblies.

Why Choose EP3SE50F484I4N?

The EP3SE50F484I4N combines significant programmable logic resources, embedded RAM and a high I/O count in an industrial-grade, surface-mount FCBGA package. Its specification set is suited to designers who need substantial on-chip capacity and reliable operation across a wide temperature range.

This device is an option for teams building complex, memory-aware FPGA designs that must meet industrial environmental requirements while maintaining a compact board footprint and flexible I/O connectivity.

Request a quote or submit a pricing inquiry to evaluate EP3SE50F484I4N for your next design.