EP3SE50F484I4L

IC FPGA 296 I/O 484FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 296 5760000 47500 484-BBGA, FCBGA

Quantity 936 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O296Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5760000

Overview of EP3SE50F484I4L – Stratix® III E FPGA, 47,500 logic elements, 484-FBGA

The EP3SE50F484I4L is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-capacity programmable fabric with 47,500 logic elements and approximately 5.76 Mbits of embedded memory, delivered in a 484-BBGA FCBGA package.

Designed for industrial environments, this device offers broad I/O resources and a low-voltage core supply range, making it suitable for designs that require substantial on-chip logic and memory in a compact surface-mount package.

Key Features

  • Core Capacity  47,500 logic elements and 1,900 LABs provide substantial programmable logic for mid- to high-complexity designs.
  • Embedded Memory  Approximately 5.76 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
  • I/O Resources  296 user I/O pins to accommodate multiple interfaces, peripheral connections, and board-level integration.
  • Power  Core voltage supply range from 860 mV to 1.15 V, supporting low-voltage FPGA core operation and power-optimized designs.
  • Package & Mounting  Available in a 484-BBGA, FCBGA package (supplier package: 484-FBGA, 23×23) for surface-mount PCB assembly and compact system footprints.
  • Operating Range  Industrial-grade operating temperature range of –40 °C to 100 °C for deployment in demanding thermal environments.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High logic density: 47,500 logic elements enable implementation of complex digital functions on a single device, reducing board-level component count.
  • Substantial on-chip RAM: Approximately 5.76 Mbits of embedded memory supports data buffering, local processing, and reduced external memory dependence.
  • Generous I/O availability: 296 I/O pins allow flexible interfacing with sensors, peripherals, and system buses without extensive external multiplexing.
  • Compact FCBGA packaging: The 484-BBGA (484-FBGA, 23×23) package delivers a balance of pin count and board space efficiency for dense designs.
  • Industrial temperature rating: Rated from –40 °C to 100 °C for reliable operation in temperature-variable environments.
  • Low-voltage core operation: Core supply range of 860 mV to 1.15 V supports power-conscious system designs.

Why Choose EP3SE50F484I4L?

The EP3SE50F484I4L positions itself as a robust, industrial-grade FPGA option for designs that need significant on-chip logic and memory while maintaining a compact footprint. Its combination of 47,500 logic elements, approximately 5.76 Mbits of embedded RAM, and 296 I/Os makes it well suited for systems requiring substantial programmable resources without extensive external components.

With a low-voltage core range and support for surface-mount FCBGA packaging, this device offers designers a balance of density, power efficiency, and thermal operating range for longer-term deployment in industrial applications.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SE50F484I4L.

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