EP3SE50F484I4L
| Part Description |
Stratix® III E Field Programmable Gate Array (FPGA) IC 296 5760000 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 936 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5760000 |
Overview of EP3SE50F484I4L – Stratix® III E FPGA, 47,500 logic elements, 484-FBGA
The EP3SE50F484I4L is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-capacity programmable fabric with 47,500 logic elements and approximately 5.76 Mbits of embedded memory, delivered in a 484-BBGA FCBGA package.
Designed for industrial environments, this device offers broad I/O resources and a low-voltage core supply range, making it suitable for designs that require substantial on-chip logic and memory in a compact surface-mount package.
Key Features
- Core Capacity 47,500 logic elements and 1,900 LABs provide substantial programmable logic for mid- to high-complexity designs.
- Embedded Memory Approximately 5.76 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
- I/O Resources 296 user I/O pins to accommodate multiple interfaces, peripheral connections, and board-level integration.
- Power Core voltage supply range from 860 mV to 1.15 V, supporting low-voltage FPGA core operation and power-optimized designs.
- Package & Mounting Available in a 484-BBGA, FCBGA package (supplier package: 484-FBGA, 23×23) for surface-mount PCB assembly and compact system footprints.
- Operating Range Industrial-grade operating temperature range of –40 °C to 100 °C for deployment in demanding thermal environments.
- Regulatory RoHS compliant.
Unique Advantages
- High logic density: 47,500 logic elements enable implementation of complex digital functions on a single device, reducing board-level component count.
- Substantial on-chip RAM: Approximately 5.76 Mbits of embedded memory supports data buffering, local processing, and reduced external memory dependence.
- Generous I/O availability: 296 I/O pins allow flexible interfacing with sensors, peripherals, and system buses without extensive external multiplexing.
- Compact FCBGA packaging: The 484-BBGA (484-FBGA, 23×23) package delivers a balance of pin count and board space efficiency for dense designs.
- Industrial temperature rating: Rated from –40 °C to 100 °C for reliable operation in temperature-variable environments.
- Low-voltage core operation: Core supply range of 860 mV to 1.15 V supports power-conscious system designs.
Why Choose EP3SE50F484I4L?
The EP3SE50F484I4L positions itself as a robust, industrial-grade FPGA option for designs that need significant on-chip logic and memory while maintaining a compact footprint. Its combination of 47,500 logic elements, approximately 5.76 Mbits of embedded RAM, and 296 I/Os makes it well suited for systems requiring substantial programmable resources without extensive external components.
With a low-voltage core range and support for surface-mount FCBGA packaging, this device offers designers a balance of density, power efficiency, and thermal operating range for longer-term deployment in industrial applications.
Request a quote or submit an inquiry to obtain pricing and availability for EP3SE50F484I4L.

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