EP3SE50F484I3N

The EP3SE50F484I3N is a Stratix® III E field programmable gate array (FPGA) in a 484‑ball BGA FCBGA package. It delivers high logic capacity and embedded RAM in a surface‑mount FPGA tailored for industrial temperature operation.

Key on‑chip resources include 47,500 logic elements, approximately 5.76 Mbits of embedded memory, and 296 I/O pins, supporting complex, high‑density digital designs that require substantial logic, memory, and connectivity within a compact package.

Key Features

• Core Logic 47,500 logic elements provide extensive programmable logic capacity for implementing complex digital functions and custom processing pipelines.
• Embedded Memory Approximately 5.76 Mbits of on‑chip RAM available for buffering, packet storage, and data‑path implementations.
• I/O Density 296 I/O pins support wide external interfacing options and multiple parallel interfaces in a single device.
• Power Operates from a core voltage range of 0.86 V to 1.15 V, enabling integration with low‑voltage system designs.
• Package & Mounting Supplied in a 484‑BBGA (FCBGA) surface‑mount package, supplier package 484‑FBGA (23×23), for compact board integration.
• Temperature Grade Industrial operating range from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Regulatory RoHS compliant.

Typical Applications

• High‑density logic implementations — Use the 47,500 logic elements to implement complex state machines, datapaths, and custom processing engines.
• Memory‑intensive designs — Approximately 5.76 Mbits of embedded RAM supports buffering, FIFOs, and on‑chip storage for real‑time data handling.
• Multi‑interface systems — 296 I/O pins enable multiple parallel and serial interfaces to sensors, controllers, and peripherals.
• Industrial control and embedded systems — Industrial temperature rating and a compact BGA package suit rugged embedded applications where thermal range and board density matter.

Unique Advantages

• High logic capacity: 47,500 logic elements allow implementation of large, integrated digital functions without external CPLDs or discrete logic.
• Substantial on‑chip memory: Approximately 5.76 Mbits of embedded RAM reduces reliance on external memory for many buffering and data‑path tasks.
• Extensive I/O: 296 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Industrial temperature range: −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact FCBGA package: 484‑ball BGA (23×23) enables high integration on space‑constrained PCBs while supporting surface‑mount assembly.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose EP3SE50F484I3N?

The EP3SE50F484I3N combines substantial logic resources, multi‑Mbit embedded RAM, and a high I/O count in a compact 484‑BBGA FCBGA package, making it a practical choice for designers who need on‑chip capacity and connectivity within an industrial temperature envelope. Its low core voltage range supports integration into modern low‑voltage power architectures.

This FPGA is well suited for development teams and procurement groups building high‑density digital systems that require reliable operation across a broad temperature range, compact board footprint, and clear, verifiable on‑chip resources for logic, memory, and I/O.

Request a quote or submit a procurement inquiry to evaluate EP3SE50F484I3N for your next design.