EP3SE50F484I3

The EP3SE50F484I3 is a Stratix® III E field programmable gate array (FPGA) IC from Intel, offered in a 484-ball BGA FCBGA package. It delivers a high-density programmable logic fabric combined with on-chip embedded memory and a broad I/O complement for demanding embedded and industrial applications.

Designed for industrial-grade deployments, this device provides a voltage supply range of 0.86 V to 1.15 V and an operating temperature range of −40 °C to 100 °C, enabling reliable operation across extended environmental conditions.

Key Features

• Logic Capacity — 47,500 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM to support buffers, state machines and local data storage.
• I/O Resources — 296 user I/O pins to interface with sensors, peripherals and external memory devices.
• Power — Core voltage supply range of 860 mV to 1.15 V to match system power architectures.
• Package & Mounting — 484-BBGA (484-FBGA, 23×23) FCBGA surface-mount package for compact, high-density board integration.
• Industrial Grade — Specified for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control — Use the device’s 47,500 logic elements and industrial temperature rating to implement motor control, PLC logic and deterministic control systems.
• Data Acquisition & Processing — Embedded memory and ample I/O allow local buffering, preprocessing and aggregation of sensor data in instrumentation and monitoring systems.
• Embedded System Integration — High logic density and 296 I/Os enable implementation of glue logic, protocol bridging and custom peripheral interfaces.
• Prototyping and Development — Reconfigurable logic and on-chip RAM support rapid iteration of hardware designs and algorithm validation.

Unique Advantages

• High Logic Density: 47,500 logic elements provide room for complex designs without immediate migration to larger families.
• Significant On-Chip Memory: Approximately 5.76 Mbits of embedded RAM reduces dependency on external memory for many buffering and state-storage needs.
• Robust I/O Count: 296 I/O pins accommodate multiple parallel interfaces and extensive peripheral connectivity on a single device.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support harsh or variable operating environments.
• Compact BGA Package: 484-ball FCBGA (23×23) enables high-density PCB layouts while maintaining a surface-mount form factor.
• Compliance: RoHS compliance simplifies deployment in lead-free manufacturing processes.

Why Choose EP3SE50F484I3?

EP3SE50F484I3 combines substantial programmable logic, meaningful embedded memory and a large I/O count in a compact 484-BBGA package, making it well suited for engineers who need a flexible, industrial-grade FPGA for complex embedded systems. Its specified voltage range and extended operating temperature support reliable integration into equipment designed for industrial and demanding environments.

This device is appropriate for development teams and OEMs seeking a scalable FPGA building block that balances integration, performance and environmental resilience while supporting industry-standard surface-mount assembly practices.

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