EP3SE50F484I3G

The EP3SE50F484I3G is an industrial-grade Stratix® III E FPGA in a 484-ball FCBGA package, offering 47,500 logic elements and approximately 5.76 Mbits of embedded memory. It is designed for memory- and multiplier-rich, data-centric applications that require a high level of integration, flexible I/O, and selectable core voltage operation.

With 296 user I/O pins, a 0.86–1.15 V core supply range, and an operating temperature range of −40 °C to 100 °C, this device targets system designs where on-chip memory, DSP resources, and configurable I/O are critical to performance and integration.

Key Features

• Logic Capacity — 47,500 logic elements to implement complex, high-density digital logic and control functions.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive processing.
• Configurable I/O — 296 user I/O pins in a modular bank structure to support diverse I/O standards and system interfaces.
• Package & Mounting — 484-BBGA (FCBGA) surface-mount package; supplier device package 484-FBGA (23×23) for compact board-level integration.
• Core Voltage Range — Selectable core supply from 860 mV to 1.15 V to balance power and performance per system requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• Power & Reliability Features (family) — Stratix III family features include Programmable Power Technology and selectable core voltage to minimize power where appropriate.
• DSP & Memory-Rich Architecture (family) — The Stratix III E family emphasizes memory- and multiplier-rich resources for data-centric signal processing and acceleration.
• Security & Reliability (family) — Family-level options include 256-bit AES configuration key support and configuration memory error detection for higher availability systems.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• High-performance signal processing — Implement DSP chains and multiply-accumulate operations using the Stratix III E family’s multiplier and memory resources for radio, radar, and high-throughput filtering tasks.
• Networking & Communications — Use the device’s rich I/O and on-chip memory to build packet-processing, bus-bridging, and protocol-acceleration blocks.
• Embedded compute and control — Integrate custom logic, memory buffering, and peripherals for industrial controllers, motion control, and complex state machines.

Unique Advantages

• High integration density: 47,500 logic elements and approximately 5.76 Mbits of embedded RAM reduce external component count and simplify board design.
• Flexible I/O configuration: 296 user I/Os in a compact FCBGA package let you route multiple interfaces without sacrificing board space.
• Selectable core voltage: 0.86–1.15 V core supply enables designers to tune the device for power vs. performance trade-offs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in thermally demanding industrial environments.
• Family-level power and security features: Stratix III family technologies such as programmable power control and AES configuration options enhance system robustness and IP protection.

Why Choose EP3SE50F484I3G?

The EP3SE50F484I3G positions itself as a highly integrated FPGA solution for designers who need substantial on-chip memory, DSP capability, and flexible I/O in an industrial-temperature device. Its 47,500 logic elements, approximately 5.76 Mbits of embedded RAM, and 296 I/Os in a 484-ball FCBGA package make it suitable for data-centric applications where board-level integration and configurability are priorities.

Choose this device when your design requires a balance of logic capacity, on-chip memory, selectable core voltage, and the reliability expected in industrial deployments, while leveraging Stratix III family features for power management and configuration security.

Request a quote or submit an inquiry to get pricing, lead-time, and availability for the EP3SE50F484I3G. Representatives can provide sample, volume, and technical support information to help evaluate the device for your next design.