EP3SE50F484I4LN

The EP3SE50F484I4LN is an Intel Stratix® III E field programmable gate array (FPGA) provided in a 484‑FBGA (23×23) FCBGA package for surface-mount applications. It delivers a high-density programmable fabric with 47,500 logic elements and approximately 5.76 Mbits of embedded RAM for designs that require substantial on-chip logic and memory resources.

With 296 I/Os, an industrial operating temperature range of −40 °C to 100 °C, and a core supply range of 0.86 V to 1.15 V, this device is suited to systems that need large logic capacity, significant embedded memory, and extended-temperature operation.

Key Features

• Core Logic 47,500 logic elements provide high-density programmable resources for implementing complex digital functions and custom logic blocks.
• Embedded Memory Approximately 5.76 Mbits of on-chip RAM for buffering, look-up tables, and local data storage without external memory.
• I/O Count 296 I/O pins support multiple external interfaces and parallel connections to peripherals and subsystems.
• Power and Voltage Core voltage supply from 0.86 V to 1.15 V to match system power-rail requirements and enable standard Stratix III E power architectures.
• Package and Mounting Supplied in a 484‑BBGA FCBGA package (supplier package: 484‑FBGA, 23×23) for surface-mount assembly in compact board layouts.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to support applications requiring extended temperature tolerance.
• Regulatory Compliance RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• High-density programmable logic systems — Implement complex, custom digital functions using the device’s 47,500 logic elements and flexible routing resources.
• Memory-intensive processing — Use approximately 5.76 Mbits of embedded RAM for buffering, packet processing, and local data storage without relying solely on external memory.
• I/O-rich interface consolidation — Leverage 296 I/Os to consolidate multiple interfaces and peripherals onto a single programmable device.
• Extended-temperature equipment — Deploy in systems that operate across −40 °C to 100 °C environments where industrial temperature capability is required.

Unique Advantages

• High logic capacity: 47,500 logic elements provide the headroom needed for sizeable custom logic implementations and feature-rich FPGA designs.
• Substantial on-chip memory: Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory, simplifying board design and latency-sensitive functions.
• Extensive I/O resources: 296 I/Os allow direct connectivity to multiple peripherals and parallel interfaces, minimizing external glue logic.
• Industrial temperature operation: −40 °C to 100 °C rating supports deployment in demanding thermal environments.
• Compact FCBGA package: 484‑FBGA (23×23) delivers high pin count in a space-efficient form factor for dense PCB layouts.
• RoHS compliant: Conforms to lead‑free manufacturing requirements for integration into modern production processes.

Why Choose EP3SE50F484I4LN?

The EP3SE50F484I4LN offers a balance of high-density programmable logic, significant embedded memory, and broad I/O capability in a compact 484‑FBGA package. Its industrial temperature rating and controlled core voltage range make it suitable for designs that demand robust on-chip resources and extended-environment operation.

This device is appropriate for engineers and procurement teams specifying Intel Stratix® III E family FPGAs where 47,500 logic elements, approximately 5.76 Mbits of on-chip RAM, and up to 296 I/Os are required. It provides a straightforward option when consolidating logic, memory, and interfaces into a single programmable device while meeting RoHS requirements.

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