EP3SE50F780C4G

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 488 5760000 47500 780-BBGA, FCBGA

Quantity 274 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits5760000

Overview of EP3SE50F780C4G – Stratix® III E Field Programmable Gate Array, 780-BBGA (FCBGA)

The EP3SE50F780C4G is a Stratix® III E family FPGA in a 780-ball FCBGA package, offering a memory- and multiplier-rich architecture for data-centric designs. Built on the Stratix III family architecture, it delivers a balance of programmable logic, embedded memory, and DSP resources intended for high-performance logic, DSP and complex I/O integration.

This device targets applications that require significant on-chip memory and arithmetic capability while providing flexible I/O and power management options, with operating support and features documented in the Stratix III device handbook.

Key Features

  • Logic Capacity — 47,500 logic elements to implement complex logic and control functions.
  • Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for FIFOs, buffers and data storage close to logic.
  • DSP and Multiplier Resources — Stratix III E family is optimized for memory- and multiplier-rich workloads, providing dedicated DSP blocks for high-throughput arithmetic.
  • I/O and High-Speed Interfaces — 488 user I/O pins with modular I/O bank structure and support for high-speed differential signaling and SERDES features described for the family.
  • Clocking and Timing — Support for multiple clock domains with up to 12 PLLs per device for clock synthesis, reconfiguration and dynamic phase adjustments (family capability).
  • Power and Voltage — Selectable core voltage operation with a supply range of 0.86 V to 1.15 V and on-package/on-die decoupling strategies described for the family.
  • Reliability and Security — Family-level features include optional 256-bit AES volatile and non-volatile configuration encryption and configuration error detection and correction mechanisms.
  • Package and Mounting — 780-BBGA (supplier package: 780-FBGA, 29×29 mm) surface-mount package; commercial grade operation from 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-performance DSP systems — Use the device’s multiplier-rich architecture and embedded memory to implement filters, accelerators, and other signal-processing tasks.
  • Networking and communications — Leverage modular I/O banks, differential signaling support and SERDES-family capabilities for protocol handling and high-speed link interfaces.
  • Memory interface controllers — Implement DDR/DDR2/DDR3 and other memory controllers using on-chip memory and dedicated memory-interface support available in the Stratix III family.
  • Embedded compute and control — Combine logic, on-chip RAM and DSP resources to realize custom embedded processors, offload engines or peripheral bridge functions.

Unique Advantages

  • High logic and memory integration: 47,500 logic elements paired with approximately 5.76 Mbits of embedded RAM reduce external memory dependence and simplify board-level design.
  • Memory- and multiplier-focused architecture: The Stratix III E family emphasizes embedded memory and DSP resources, enabling efficient implementation of data-centric algorithms.
  • Configurable power profile: Selectable core voltage and family-level Programmable Power Technology enable designers to balance performance and power consumption.
  • Robust I/O flexibility: 488 user I/Os in a modular bank structure support a broad range of signaling standards and high-speed interfaces for system integration.
  • Security and reliability features: Optional 256-bit AES configuration encryption and configuration memory error detection/correction support deployment in systems requiring protection and availability.
  • Commercial temperature and standard package: Surface-mount 780-BBGA package and 0 °C to 85 °C operating range suited to a wide range of commercial applications.

Why Choose EP3SE50F780C4G?

The EP3SE50F780C4G combines substantial logic capacity, multi-megabit on-chip memory and DSP-oriented architecture in a compact 780-ball FCBGA package, making it suitable for designers building data-intensive, high-throughput systems. Its selectable voltage operation, modular I/O structure and family-level features for security and error detection provide flexible trade-offs between performance, power and system reliability.

This FPGA is a solid choice for engineering teams needing a programmable platform with integrated memory and DSP resources, clear family-level documentation, and the ability to implement complex interfaces and memory controllers within a commercial temperature range.

Request a quote or submit an inquiry to get pricing and availability for EP3SE50F780C4G and to discuss how this Stratix® III E FPGA can fit your design requirements.

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