EP3SE50F780C4G
| Part Description |
Stratix® III E Field Programmable Gate Array (FPGA) IC 488 5760000 47500 780-BBGA, FCBGA |
|---|---|
| Quantity | 274 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5760000 |
Overview of EP3SE50F780C4G – Stratix® III E Field Programmable Gate Array, 780-BBGA (FCBGA)
The EP3SE50F780C4G is a Stratix® III E family FPGA in a 780-ball FCBGA package, offering a memory- and multiplier-rich architecture for data-centric designs. Built on the Stratix III family architecture, it delivers a balance of programmable logic, embedded memory, and DSP resources intended for high-performance logic, DSP and complex I/O integration.
This device targets applications that require significant on-chip memory and arithmetic capability while providing flexible I/O and power management options, with operating support and features documented in the Stratix III device handbook.
Key Features
- Logic Capacity — 47,500 logic elements to implement complex logic and control functions.
- Embedded Memory — Approximately 5.76 Mbits of on-chip RAM for FIFOs, buffers and data storage close to logic.
- DSP and Multiplier Resources — Stratix III E family is optimized for memory- and multiplier-rich workloads, providing dedicated DSP blocks for high-throughput arithmetic.
- I/O and High-Speed Interfaces — 488 user I/O pins with modular I/O bank structure and support for high-speed differential signaling and SERDES features described for the family.
- Clocking and Timing — Support for multiple clock domains with up to 12 PLLs per device for clock synthesis, reconfiguration and dynamic phase adjustments (family capability).
- Power and Voltage — Selectable core voltage operation with a supply range of 0.86 V to 1.15 V and on-package/on-die decoupling strategies described for the family.
- Reliability and Security — Family-level features include optional 256-bit AES volatile and non-volatile configuration encryption and configuration error detection and correction mechanisms.
- Package and Mounting — 780-BBGA (supplier package: 780-FBGA, 29×29 mm) surface-mount package; commercial grade operation from 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Typical Applications
- High-performance DSP systems — Use the device’s multiplier-rich architecture and embedded memory to implement filters, accelerators, and other signal-processing tasks.
- Networking and communications — Leverage modular I/O banks, differential signaling support and SERDES-family capabilities for protocol handling and high-speed link interfaces.
- Memory interface controllers — Implement DDR/DDR2/DDR3 and other memory controllers using on-chip memory and dedicated memory-interface support available in the Stratix III family.
- Embedded compute and control — Combine logic, on-chip RAM and DSP resources to realize custom embedded processors, offload engines or peripheral bridge functions.
Unique Advantages
- High logic and memory integration: 47,500 logic elements paired with approximately 5.76 Mbits of embedded RAM reduce external memory dependence and simplify board-level design.
- Memory- and multiplier-focused architecture: The Stratix III E family emphasizes embedded memory and DSP resources, enabling efficient implementation of data-centric algorithms.
- Configurable power profile: Selectable core voltage and family-level Programmable Power Technology enable designers to balance performance and power consumption.
- Robust I/O flexibility: 488 user I/Os in a modular bank structure support a broad range of signaling standards and high-speed interfaces for system integration.
- Security and reliability features: Optional 256-bit AES configuration encryption and configuration memory error detection/correction support deployment in systems requiring protection and availability.
- Commercial temperature and standard package: Surface-mount 780-BBGA package and 0 °C to 85 °C operating range suited to a wide range of commercial applications.
Why Choose EP3SE50F780C4G?
The EP3SE50F780C4G combines substantial logic capacity, multi-megabit on-chip memory and DSP-oriented architecture in a compact 780-ball FCBGA package, making it suitable for designers building data-intensive, high-throughput systems. Its selectable voltage operation, modular I/O structure and family-level features for security and error detection provide flexible trade-offs between performance, power and system reliability.
This FPGA is a solid choice for engineering teams needing a programmable platform with integrated memory and DSP resources, clear family-level documentation, and the ability to implement complex interfaces and memory controllers within a commercial temperature range.
Request a quote or submit an inquiry to get pricing and availability for EP3SE50F780C4G and to discuss how this Stratix® III E FPGA can fit your design requirements.

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