EP3SE50F780C4N

The EP3SE50F780C4N is an Intel Stratix® III E field-programmable gate array (FPGA) in a 780-BBGA FCBGA package, intended for commercial applications. It delivers high-density programmable logic, integrated memory, and extensive I/O to support complex custom hardware designs.

Device documentation for the Stratix III family identifies on‑chip DSP blocks, TriMatrix memory resources, PLL and clock-tree specifications, and configuration/JTAG capabilities, providing the technical foundation for system-level integration and timing control.

Key Features

• Logic resources — Approximately 47,500 logic elements and 1,900 logic blocks provide the density needed for complex programmable logic implementations.
• Embedded memory — Approximately 5.76 Mbits of embedded memory (total RAM bits: 5,760,000) for buffering, state storage, and local data processing.
• I/O capacity — 488 user I/O pins to support broad peripheral and external-device interfacing.
• On-chip DSP and memory architectures — Datasheet sections for DSP block specifications and TriMatrix memory block specifications support signal-processing and memory-intensive functions.
• Clocking and timing — Device handbook includes PLL and clock-tree specifications to enable controlled timing domains and high-performance clocking architectures.
• Package and mounting — 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) designed for surface-mount assembly.
• Power — Core voltage supply range of 860 mV to 1.15 V to support system power planning and power-domain design.
• Commercial grade and environmental — Commercial grade device with operating range 0 °C to 85 °C and RoHS compliance.
• Configuration and test support — Includes configuration and JTAG specification support as documented in the Stratix III device handbook.

Typical Applications

• Digital signal processing — On-chip DSP block and TriMatrix memory specifications make the device suitable for high-throughput DSP functions and algorithm acceleration.
• High-density programmable logic — Large logic element count supports complex state machines, custom accelerators, and protocol implementations.
• Communications and networking — PLL and clock-tree specifications, combined with abundant I/O, enable timing-critical interfaces and multi-channel data paths.

Unique Advantages

• High-capacity logic — Large logic element count enables consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on‑chip memory — Approximately 5.76 Mbits of embedded RAM supports buffering, lookup tables, and local storage without external memory.
• Extensive I/O — 488 I/Os allow flexible connectivity to peripherals, transceivers, and companion devices.
• Integrated timing resources — PLL and clock-tree features documented in the Stratix III handbook help implement stable, multi-domain clocking strategies.
• Surface-mount, high-pin-count package — 780-BBGA (29×29) packaging offers high-density routing for complex board-level designs.
• Regulatory and grade clarity — Commercial-grade device with RoHS compliance simplifies specification alignment for non-industrial applications.

Why Choose EP3SE50F780C4N?

The EP3SE50F780C4N positions itself as a high-density, commercial-grade Stratix III E FPGA that combines substantial logic capacity, on‑chip memory, and a large I/O complement in a high-pin-count BGA package. Its documented DSP blocks, TriMatrix memory, PLLs, and configuration/JTAG support make it suitable for designs that require integrated signal processing, complex timing domains, and dense logic implementations.

This device is appropriate for engineering teams and procurement organizations building commercial embedded systems where performance, integration, and predictable operating conditions (0 °C to 85 °C) are key selection criteria.

Request a quote or submit an RFQ to check availability and lead time for the EP3SE50F780C4N.