EP3SE80F1152C4

The EP3SE80F1152C4 is a Stratix® III E field programmable gate array (FPGA) device from Intel, supplied in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package. It provides a combination of dense logic resources, on-chip memory, and a large I/O count for commercial embedded designs.

This device is suited to applications that require substantial programmable logic capacity and significant on-chip RAM while operating within standard commercial temperature and supply-voltage ranges.

Key Features

• Configurable Logic Blocks (CLBs) — 3,200 CLBs delivering a total of 80,000 logic elements for implementing complex digital functions.
• On‑Chip Memory — Approximately 6.84 Mbits of embedded memory to support buffering, lookup tables, and intermediate data storage.
• High I/O Count — 744 user I/O pins to support dense external interfacing and multi-channel designs.
• Power and Voltage — Core voltage supply range from 860 mV to 1.15 V, enabling operation within specified supply rails.
• Package and Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board-level integration.
• Temperature and Grade — Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement control, protocol handling, and custom logic in compact, surface-mounted designs that require moderate temperature operation.
• Networking and Telecom Equipment — Use the device’s large I/O count and logic capacity for packet handling, interface bridging, and custom datapath logic.
• Signal Processing and Data Acquisition — Leverage the on-chip memory and logic resources for buffering, preprocessing, and feature extraction in data acquisition chains.
• Prototyping and Development Platforms — Provide a high-density programmable fabric for validating complex digital architectures and system integration.

Unique Advantages

• Significant Logic Density: 80,000 logic elements enable complex finite-state machines, datapaths, and custom accelerators without external logic.
• Substantial Embedded Memory: Approximately 6.84 Mbits of on-chip RAM reduce dependence on external memory for many buffering and storage tasks.
• Extensive Connectivity: 744 I/O pins provide flexible routing to peripherals, high-speed transceivers, and multi-channel interfaces.
• Compact Surface-Mount Package: The 1152-FBGA (35×35) package supports space-constrained PCB layouts while delivering high pin density.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for use in standard commercial environments.
• RoHS Compliant: Conforms to environmental standards for lead-free assembly and regulatory requirements.

Why Choose EP3SE80F1152C4?

EP3SE80F1152C4 positions itself as a high‑density Stratix® III E FPGA option for commercial applications that need a large number of logic elements, substantial on‑chip memory, and wide I/O capacity in a compact BGA package. Its specified voltage range and commercial temperature rating make it appropriate for a broad set of embedded designs operating within standard environmental conditions.

This device is a fit for engineers designing systems that require integrated programmable logic and memory resources without expanding board-level complexity—providing a scalable platform for prototyping and production where these specific hardware resources are required.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SE80F1152C4 and to discuss how it fits your next design.