EP3SE80F1152C4LG

The EP3SE80F1152C4LG is an Intel Stratix III family FPGA in a 1152-ball BGA package designed for high-performance logic, DSP and embedded applications. It delivers approximately 80,000 logic elements and significant on-chip memory to support complex algorithms and data processing tasks.

Built on the Stratix III architecture, the device emphasizes performance and power efficiency through features such as selectable core voltage and programmable power technology, while offering extensive I/O and package options for system integration.

Key Features

• Logic Capacity — Approximately 80,000 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 6.84 Mbits of total on-chip RAM for buffering, FIFOs and local data storage.
• I/O Density — 744 user I/O pins to support wide-ranging parallel and high-pin-count interfaces.
• Power and Voltage — Selectable core voltage operation with a supply range of 0.86 V to 1.15 V to balance performance and power consumption.
• Package and Mounting — 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact, high-density board designs.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS-compliant.
• Stratix III Architecture Benefits — Family-level features include programmable power technology, selectable core voltage, advanced clocking and PLL capabilities, high-speed DSP resources, optional 256-bit AES configuration security, and error detection/correction mechanisms for configuration and memory integrity.

Typical Applications

• High-performance DSP and signal processing — Use on-chip logic and embedded memory to implement filters, transforms and real-time data pipelines.
• Networking and communications — Dense I/O and Stratix III architecture support modular I/O banks and high-speed interfaces for packet processing and protocol bridging.
• Memory interface controllers — On-chip resources and modular I/O support memory interface implementations and buffering for external SDRAM or SRAM systems.
• Embedded compute and prototyping — Large logic capacity and on-chip memory enable custom processors, accelerators and prototype ASIC replacement designs.

Unique Advantages

• High logic and memory capacity: Approximately 80,000 logic elements and ~6.84 Mbits of embedded RAM reduce the need for external components and simplify board design.
• Flexible power/performance trade-offs: Selectable core voltage and programmable power technology allow tuning for target performance or lower power consumption.
• Extensive I/O: 744 user I/O pins enable integration with multiple parallel buses, high-pin-count peripherals and complex front-end systems.
• Compact, manufacturable package: 1152-ball FCBGA surface-mount package supports high-density system designs while remaining RoHS-compliant.
• Architectural reliability features: Stratix III family features such as optional AES configuration security and on-chip error detection/correction contribute to system robustness.

Why Choose EP3SE80F1152C4LG?

The EP3SE80F1152C4LG combines substantial logic resources, multi-megabit on-chip RAM and high I/O density in a compact 1152-ball FCBGA package, making it a solid choice for designers implementing demanding logic, DSP and embedded systems at commercial temperature ranges. Its Stratix III architecture provides configurable power and clocking features that help balance throughput and power budget for a wide range of applications.

This device suits teams needing scalable FPGA capacity with integrated memory and robust system-level features, backed by the Stratix III family technical capabilities for high-performance, configurable designs.

Request a quote or submit an inquiry for pricing and availability of EP3SE80F1152C4LG to begin integrating this Stratix III FPGA into your next design.