EP3SE80F1152I3

The EP3SE80F1152I3 is an Intel Stratix® III E FPGA in a high-density FCBGA package, offering 80,000 logic elements and a large embedded memory complement. It targets designs that require substantial logic capacity, high I/O count and significant on-chip RAM for complex digital processing and system integration.

With an operating voltage range of 0.86 V to 1.15 V and an industrial-grade operating temperature span from −40 °C to 100 °C, this device is suited for applications demanding robust performance across a wide thermal range while maintaining a compact surface-mount package footprint.

Key Features

• Logic Capacity: 80,000 logic elements provide substantial programmable logic resources for implementing complex digital functions and custom architectures.
• Embedded Memory: Approximately 6.84 Mbits of on-chip RAM to support data buffering, lookup tables and state storage without external memory dependence.
• I/O Density: 744 user I/Os enable extensive external interfacing for multi-channel systems and high-pin-count designs.
• Power: Core supply range of 0.86 V to 1.15 V supports optimized power domain design and voltage-constrained system integration.
• Package & Mounting: Available in a 1152-ball FCBGA/FBGA package (1152-FBGA, 35×35) designed for surface-mount assembly to minimize board area while preserving thermal and electrical performance.
• Temperature & Grade: Industrial-grade device rated for operation from −40 °C to 100 °C for use in environments requiring extended temperature range.
• RoHS Compliance: RoHS‑compliant designation for regulatory and environmental alignment.

Typical Applications

• High-density digital processing: Implement complex state machines, protocol handling and custom data-paths using the device’s large logic and memory resources.
• High-channel I/O systems: Supports multiport interfacing and parallel sensor arrays where a high number of user I/Os is required.
• Industrial control and automation: Industrial-grade temperature range and robust packaging make it suitable for control logic, motion control and system orchestration tasks.
• Prototyping and system integration: High logic element count and embedded memory enable rapid hardware prototyping and consolidation of multiple functions into a single FPGA.

Unique Advantages

• Substantial on-chip resources: Large logic element count and ~6.84 Mbits of embedded RAM reduce the need for external components and simplify board-level design.
• High I/O count: 744 user I/Os allow flexible connectivity for complex systems with multiple peripherals and interfaces.
• Industrial temperature capability: Rated from −40 °C to 100 °C to maintain operation across a wide range of environmental conditions.
• Compact BGA packaging: 1152-ball FCBGA (35×35) surface-mount package balances density and manufacturability for volume assembly.
• Controlled core voltage range: Operates from 0.86 V to 1.15 V enabling targeted power planning and integration with modern power supplies.

Why Choose EP3SE80F1152I3?

The EP3SE80F1152I3 combines high logic density, significant embedded memory and a very large I/O complement in a single industrial-grade FCBGA package. It is positioned for engineering teams that need to integrate complex digital functions, consolidate board-level components, and maintain operation across extended temperature ranges.

This device delivers long-term value through a combination of scalable on-chip resources and a compact surface-mount package, helping to reduce BOM complexity and streamline system design for high-density and I/O-rich applications.

Request a quote or submit an inquiry to discuss pricing, availability and how EP3SE80F1152I3 can be integrated into your design. Our team can provide technical and procurement assistance to support your next project.