EP3SE80F1152I4

The EP3SE80F1152I4 is a Stratix® III E Field Programmable Gate Array (FPGA) IC offering a high-density, industrial-grade programmable logic platform. It integrates a large logic fabric, substantial on-chip memory and a high I/O count in a 1152-BBGA FCBGA package for surface-mount assembly.

With 80,000 logic elements, approximately 6.84 Mbits of embedded memory and 744 I/O pins, this device is targeted at industrial designs that require reconfigurable logic, significant local memory and robust temperature performance.

Key Features

• Core / Logic: 80,000 logic elements provide a large programmable fabric to implement complex custom logic and control functions.
• Embedded Memory: Approximately 6.84 Mbits of on-chip RAM to support buffering, lookup tables and local data storage without external memory in many designs.
• I/O Density: 744 I/O pins enable dense peripheral interfacing, multiple parallel buses or numerous sensor and actuator connections.
• Power Supply: Operates within a core voltage window of 860 mV to 1.15 V, allowing designers to plan power delivery and sequencing to match system constraints.
• Package & Mounting: 1152-BBGA / FCBGA package (supplier package: 1152-FBGA (35x35)) in a surface-mount form factor for compact, high-pin-count board designs.
• Temperature & Grade: Industrial-grade device rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.

Typical Applications

• Industrial Control Systems — High logic capacity and industrial temperature rating support complex control algorithms, protocol conversion and real-time decision logic in factory and process environments.
• Data Acquisition & Signal Processing — Large on-chip RAM and abundant logic elements allow implementation of filtering, buffering and custom signal-processing pipelines close to sensors.
• Communications & Networking — 744 I/O pins provide the channel density needed for parallel interfaces, multi‑lane links and board-level protocol bridging.
• Custom Hardware Acceleration — Reconfigurable logic resources enable designers to implement application-specific accelerators and offload compute tasks from CPUs.

Unique Advantages

• High Logic Capacity: 80,000 logic elements enable substantial on-chip functionality and consolidation of multiple functions into a single device, reducing BOM complexity.
• Significant Embedded Memory: Approximately 6.84 Mbits of RAM supports large buffers and state storage without immediate reliance on external memory, improving throughput and latency.
• Very High I/O Count: 744 I/O pins provide flexibility for dense board-level connectivity and parallel interfacing to peripherals and sensors.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to maintain operation in harsh or thermally challenging environments.
• Compact, High-Pin Package: 1152-BBGA / FCBGA packaging offers a high pin count in a surface-mount footprint suitable for space-constrained designs.
• Flexible Power Window: Core supply range of 860 mV to 1.15 V enables power design options tailored to system requirements.

Why Choose EP3SE80F1152I4?

The EP3SE80F1152I4 positions itself as a robust, high-capacity Stratix® III E FPGA for industrial applications requiring substantial programmable logic, on-chip memory and extensive I/O. Its combination of 80,000 logic elements, roughly 6.84 Mbits of embedded RAM and 744 I/O pins supports consolidation of complex functions and high-density interfacing in a single device.

This industrial-grade FPGA is suitable for engineers designing control systems, data acquisition, communication interfaces or custom accelerators who need a reliable, configurable platform with a compact high-pin-count package and a core voltage and temperature range compatible with demanding system requirements.

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