EP3SE80F1152I4LG

The EP3SE80F1152I4LG is a high-density Stratix III family FPGA from Intel designed for performance-oriented, industrial applications. It provides a programmable logic fabric with abundant logic resources, embedded memory, and flexible I/O to support complex digital signal processing, high-speed interfaces, and system integration tasks.

Built on the Stratix III device family architecture, this device targets designs that require substantial logic capacity, modular I/O, and configurable power and clock resources while operating across an industrial temperature range.

Key Features

• Logic Capacity — Approximately 80,000 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for FIFOs, buffers, and mapped storage.
• I/O Resources — 744 user I/O pins suitable for multi-bank interfacing and parallel/high-speed signalling.
• Core Voltage — Selectable core supply range from 860 mV to 1.15 V, enabling trade-offs between performance and power.
• Package and Mounting — 1152-FBGA (35×35) FCBGA package, surface-mount for compact system integration.
• Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for deployed systems in industrial environments.
• Stratix III Family Capabilities — Family-level features include programmable power technology, abundant clock and PLL resources, dedicated DSP multiplier blocks, dynamic on-chip termination, and optional 256-bit AES configuration security (as documented in the Stratix III device handbook).
• Reliability and Compliance — RoHS-compliant device package suitable for industry-standard manufacturing requirements.

Typical Applications

• High-performance DSP and Signal Processing — Use the device's large logic element count and on-chip memory for multi-channel DSP pipelines, filters, and accelerator functions.
• Networking and Communications — Implement protocol handling, custom packet processing, and interface logic leveraging the device’s modular I/O and family support for high-speed serial and parallel interfaces.
• Memory Interface and Controller Designs — Build DDR/DDR2/DDR3 and other external memory controllers using the available logic, memory blocks, and I/O resources.
• Embedded System Integration — Integrate custom peripherals, hardware accelerators, and soft processors into industrial control, instrumentation, and automation systems.

Unique Advantages

• High Logic Density: Approximately 80,000 logic elements enable complex, feature-rich designs without immediate migration to a larger device.
• Substantial On-chip RAM: ~6.84 Mbits of embedded memory reduce external memory dependencies for buffering and local storage.
• Wide I/O Count: 744 user I/O pins provide flexibility for parallel interfaces, multiple banks, and mixed-signal connectivity.
• Configurable Power Envelope: Core voltage range (860 mV–1.15 V) supports tuning for lower power or higher performance within the Stratix III architecture.
• Industrial-ready Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact Package: 1152-FBGA (35×35) packaging balances high pin count with a small board footprint for dense system designs.

Why Choose EP3SE80F1152I4LG?

The EP3SE80F1152I4LG combines high logic capacity, multi-megabit embedded memory, and extensive I/O in an industrial-grade Stratix III FPGA package. It is positioned for engineers who need a programmable, high-performance platform for DSP, networking, and complex system integration while retaining options to balance power and performance through selectable core voltage.

This device is suited to teams developing robust, scalable designs that benefit from the Stratix III family’s architecture and feature set—offering a pathway to integrate custom logic, memory interfaces, and interface subsystems within a compact, industry-rated package.

Request a quote or submit a pricing and availability inquiry to receive tailored information for your project needs and volume requirements.