EP3SE80F780C2

The EP3SE80F780C2 is a Stratix® III E Field Programmable Gate Array (FPGA) in a 780-BBGA (FCBGA) package from Intel. It provides high logic capacity and significant on-chip memory combined with a substantial I/O complement for demanding programmable-logic designs.

Key device characteristics include 80,000 logic elements, 3,200 LABs, approximately 6.84 Mbits of embedded memory, 488 I/O pins, a supply voltage range of 860 mV to 1.15 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  80,000 logic elements and 3,200 LABs provide large programmable logic capacity for complex designs.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
• I/O Capability  488 I/O pins enable broad peripheral interfacing and system-level connectivity.
• Power  Supports a core voltage supply range from 860 mV to 1.15 V to match system power domains.
• Package & Mounting  780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount assembly.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-capacity programmable logic systems  Designs that require large numbers of logic elements and extensive on-chip memory.
• Data buffering and control fabrics  Use of the device's embedded RAM and abundant I/O for local buffering and control logic.
• Board-level integration  Compact 780-FBGA package and surface-mount mounting simplify placement in dense board designs.

Unique Advantages

• High logic density: 80,000 logic elements enable complex implementations without external programmable logic.
• Substantial on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces the need for external memory in many designs.
• Extensive I/O: 488 I/O pins provide flexibility for interfacing multiple peripherals and system buses.
• Compact package: 780-FBGA (29×29) layout supports high-density board integration while remaining surface-mount compatible.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial applications.
• RoHS compliant: Meets environmental compliance requirements for lead-free assemblies.

Why Choose EP3SE80F780C2?

The EP3SE80F780C2 positions itself as a high-capacity Stratix® III E FPGA option for designs that demand large programmable logic resources, significant embedded RAM, and broad I/O connectivity in a compact FCBGA package. Its specified voltage range and commercial temperature rating make it suitable for a wide range of standard embedded and board-level applications.

This device is appropriate for engineering teams targeting designs that require dense logic, on-chip memory to minimize external components, and a high pin count for system integration. The combination of capacity, package form factor, and compliance characteristics supports scalable, robust designs using Intel's Stratix III E family.

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